PNI MS2100 - Manual (Page 16)

PNI Sensor Corporation 133 Aviation Blvd., Suite 101, Santa Rosa, CA 95403-1084 USA;, Fax: (707) 566-2261
For the most current specifications, please visit our website at:
www.pnicorp.com DOC # 1011946 R07
21-Jan-11 Page 16 of 16-
MS2100
Specifications & Instructions
Recommended Processing Parameters
Figure 10: MS2100 Solder Profile
Table 11: Recommended Processing Parameters
Instructions for baking of PNI MS2100 Components prior to SMT
The MS2100 is shipped in a moisture resistant sealed tray containing 416 pcs (p/n 12913) or in
partial trays or smaller packages of 415 or fewer pcs (p/n 12913P) which are not sealed.
To mitigate the risk of moisture damage, PNI recommends the following procedure for all
MS2100s:
1) Peak package body temperature: 240 C
2) After the moisture seal is opened, MS2100s must be baked at 125 C (+/- 5 C) for 24
hours prior to being subjected to reflow solder or other high-temperature processes. After
this bake process is complete, the MS2100 must be mounted within 8 hours (assuming
factory conditions of temperature < 30ºC and humidity (RH) < 60% are not exceeded).
3) Unused MS2100s are to be stored in their trays and sealed. Bake as stipulated in step #2
above before use.
Note: Temperature and humidity defined by IPC/JEDEC J-STD-020
Reflow Parameter Temperature Time
Max Peak Temperature 240ºC
Soak Time at Peak Temperature 10-20 seconds
Ramp Down Rate 4°C/second max
Solder Melting Point >218ºC
Moisture Sensitivity Level: Refer to handling instructions below.