Gorman-Rupp Pumps S6B1-E95 575/3 1429763 and up - Manual (Page 47)

OM-06257 S SERIES PUMPS
PAGE E - 21 MAINTENANCE AND REPAIR
2 GREEN - TOGETHER IN ONE TERMINAL.
CONNECT TERMINAL TO
GROUND INSIDE TERMINAL
HOUSING
1 YELLOW - CONNECT TERMINAL TO GROUND
INSIDE TERMINAL HOUSING
RED
(T3)
WHITE
(T1)
BLACK
(T2)
Figure E-6. Terminal Housing Wiring Connections
Sealing Terminal Plate Connections
With Potting Compound
(Figure E-2)
Potting compound and silicone adhesive have the
same electrical properties when correctly applied.
Silicone adhesive is used at the factory to facilitate
production. A commercially available potting kit
(Products Research Corp., part number
PR‐1201‐Q Class 1 potting compound, Chemseal
potting compound, part number GS3100, or equiv­
alent) may also be used to seal the connections.
Clean and assemble all terminal components as
indicated in Sealing Terminal Plate With Silicone
Adhesive. Use medium grit sandpaper to prepare
the surface of the terminal plate in the area where
the potting mold will be installed.
NOTE
Clean the cable lead and terminal plate in the areas
to be potted with cleaning solvent before potting.
Potting compound will not adhere properly to oil or
grease coated surfaces.
Trim the potting mold so it is just long enough to
cover the terminal collars. Slide the potting mold
up over the leads of the power cable and control
cable.
Secure each cable lead as described in the pre­
vious section. Slide the potting mold down over the
terminal collars and onto the terminal plate. Hang
the cable in a vertical position with the terminal
plate horizontal. The cable leads and terminals
should be centered in the potting mold. Use quick‐
setting cement, such as `3‐M Weather Seal' to se­
cure the potting mold to the terminal plate.
Most potting base compounds contain
toluene; use adequate ventilation and
avoid prolonged breathing of vapors.
Most potting accelerators contain lead;
avoid ingestion or prolonged contact
with the skin. Read and follow all warn­
ings and recommendations accompa­
nying the potting kit.
See the instructions with the potting kit regarding
application life and setting and curing time. Mix the
base compound and accelerator and fill the mold
until the electrical connections are completely in­
sulated. Tamp the potting material to eliminate air
bubbles and ensure the material has completely
covered the area around the terminal posts.
NOTE
The potting compound must completely cover the