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Rainbow Electronics DS2788 User Manual

Page 21

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Memory

The DS2788 has a 256-byte linear memory space with

registers for instrumentation, status, and control, as well

as EEPROM memory blocks to store parameters and

user information. Byte addresses designated as

“Reserved” return undefined data when read. Reserved

bytes should not be written. Several byte registers are

paired into two-byte registers in order to store 16-bit val-

ues. The MSB of the 16-bit value is located at a even

address and the LSB is located at the next address

(odd) byte. When the MSB of a two-byte register is read,

the MSB and LSB are latched simultaneously and held

for the duration of the Read-Data command to prevent

updates to the LSB during the read. This ensures syn-

chronization between the two register bytes. For consis-

tent results, always read the MSB and the LSB of a

two-byte register during the same read data command

sequence.

EEPROM memory consists of the NV EEPROM cells over-

laid with volatile shadow RAM. The Read Data and Write

Data commands allow the 1-Wire interface to directly

accesses only the shadow RAM. The Copy Data and

Recall Data function commands transfer data between

the shadow RAM and the EEPROM cells. To modify the

data stored in the EEPROM cells, data must be written to

the shadow RAM and then copied to the EEPROM. To

verify the data stored in the EEPROM cells, the EEPROM

data must be recalled to the shadow RAM and then read

from the shadow RAM.

User EEPROM

A 16-byte user EEPROM memory (block 0, addresses

20h–2Fh) provides NV memory that is uncommitted to

other DS2788 functions. Accessing the user EEPROM

block does not affect the operation of the DS2788. User

EEPROM is lockable, and once locked, write access is

not allowed. The battery pack or host system manufac-

turer can program lot codes, date codes, and other

manufacturing, warranty, or diagnostic information and

then lock it to safeguard the data. User EEPROM can

also store parameters for charging to support different

size batteries in a host device as well as auxiliary model

data such as time to full charge estimation parameters.

Parameter EEPROM

Model data for the cells and application operating

parameters are stored in the parameter EEPROM mem-

ory (block 1, addresses 60h–7Fh). The ACR (MSB and

LSB) and AS registers are automatically saved to EEP-

ROM when the RARC result crosses 4% boundaries.

This allows the DS2788 to be located outside the pro-

tection FETs. In this manner, if a protection device is

triggered, the DS2788 cannot lose more that 4% of

charge or discharge data.

D
S

2

7

8

8

Stand-Alone Fuel-Gauge IC with

LED Display Drivers

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21

Table 3. Memory Map

ADDRESS (HEX)

DESCRIPTION

READ/WRITE

00

Reserved

R

01

STATUS: Status Register

R/W

02

RAAC: Remaining Active Absolute Capacity MSB

R

03

RAAC: Remaining Active Absolute Capacity LSB

R

04

RSAC: Remaining Standby Absolute Capacity MSB

R

05

RSAC: Remaining Standby Absolute Capacity LSB

R

06

RARC: Remaining Active Relative Capacity

R

07

RSRC: Remaining Standby Relative Capacity

R

08

IAVG: Average Current Register MSB

R

09

IAVG: Average Current Register LSB

R

0A

TEMP: Temperature Register MSB

R

0B

TEMP: Temperature Register LSB

R

0C

VOLT: Voltage Register MSB

R

0D

VOLT: Voltage Register LSB

R

0E

CURRENT: Current Register MSB

R

0F

CURRENT: Current Register LSB

R

10

ACR: Accumulated Current Register MSB

R/W*

11

ACR: Accumulated Current Register LSB

R/W*