Irlts2242pbf, Power mosfets – Rainbow Electronics IRLTS2242TRPBF User Manual
Page 5

IRLTS2242PbF
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5
Fig 12. On-Resistance vs. Gate Voltage
Fig 13. Typical On-Resistance vs. Drain Current
Fig 14. Maximum Avalanche Energy vs. Drain Current
Fig 15
. Typical Power vs. Time
*
Reverse Polarity of D.U.T for P-Channel
P.W.
Period
di/dt
Diode Recovery
dv/dt
Ripple
5%
Body Diode Forward Drop
Re-Applied
Voltage
Reverse
Recovery
Current
Body Diode Forward
Current
V
GS
=10V
V
DD
I
SD
Driver Gate Drive
D.U.T. I
SD
Waveform
D.U.T. V
DS
Waveform
Inductor Curent
D =
P.W.
Period
*
V
GS
= 5V for Logic Level Devices
*
Inductor Current
Circuit Layout Considerations
Low Stray Inductance
Ground Plane
Low Leakage Inductance
Current Transformer
di/dt controlled by R
G
Driver same type as D.U.T.
I
SD
controlled by Duty Factor "D"
D.U.T. - Device Under Test
+
-
+
+
+
-
-
-
R
G
V
DD
D.U.T
*
Fig 16.
Diode Reverse Recovery Test Circuit for P-Channel HEXFET
®
Power MOSFETs
0
5
10
15
20
-VGS, Gate -to -Source Voltage (V)
0
10
20
30
40
50
60
70
R
D
S
(o
n)
,
D
ra
in
-t
o
-S
ou
rc
e
O
n
R
es
is
ta
nc
e
(m
)
ID = -6.9A
TJ = 25°C
TJ = 125°C
0
10
20
30
40
50
60
-ID, Drain Current (A)
0
50
100
150
200
250
300
350
400
450
R
D
S
(o
n)
,
D
ra
in
-t
o
-S
ou
rc
e
O
n
R
es
is
ta
nc
e
(m
)
Vgs = -4.5V
Vgs = -2.5V
25
50
75
100
125
150
Starting TJ , Junction Temperature (°C)
0
20
40
60
80
100
120
E
A
S
,
S
in
gl
e
P
ul
se
A
va
la
nc
he
E
ne
rg
y
(m
J)
ID
TOP -1.3A
-2.0A
BOTTOM -5.5A
1E-8
1E-7
1E-6
1E-5
1E-4
1E-3
Time (sec)
0
2000
4000
6000
8000
10000
12000
14000
16000
P
ow
er
(
W
)