Rainbow Electronics MAX16904 User Manual

Page 11

2) Solder the exposed pad to a large copper plane

area under the device. To effectively use this copper
area as heat exchanger between the PCB and ambi-
ent, expose the copper area on the top and bottom
side. Add a few small vias or one large via on the
copper pad for efficient heat transfer. Connect the
exposed pad to PGND ideally at the return terminal
of the output capacitor.

3) Isolate the power components and high current

paths from sensitive analog circuitry.

4) Keep the high current paths short, especially at the

ground terminals. The practice is essential for stable
jitter-free operation.

5) Connect the PGND and GND together preferably at

the return terminal of the output capacitor. Do not
connect them anywhere else.

6) Keep the power traces and load connections short.

This practice is essential for high efficiency. Use
thick copper PCB to enhance full load efficiency and
power dissipation capability.

7) Route high-speed switching nodes away from sensi-

tive analog areas. Use internal PCB layers as PGND
to act as EMI shields to keep radiated noise away
from the device and analog bypass capacitor.

ESD Protection

The device’s ESD tolerance is rated for Human Body
Model and Machine Model. The Human Body Model
discharge components are C

= 100pF and R

= 1.5k

(Figure 1). The Machine Model discharge components
are C

= 200pF and R

= 0

Ω (Figure 2).

MAX16904

2.1MHz, High-Voltage,

600mA Mini-Buck Converter

______________________________________________________________________________________

Figure 1. Human Body ESD Test Circuit

STORAGE
CAPACITOR

HIGH-

VOLTAGE

SOURCE

DEVICE

UNDER

TEST

CHARGE-CURRENT-

LIMIT RESISTOR

DISCHARGE

RESISTANCE

1.5k

100pF