Electrical and mechanical characteristics, t, 25°c unless otherwise specified inverter sector, Thermal and mechanical characteristics, t – C&H Technology CM200RX-12A User Manual
Page 4: 25°c unless otherwise specified

CM200RX-12A
Six IGBTMOD™ + Brake NX-Series Module
200 Amperes/600 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272
3
Rev. 11/08
Electrical and Mechanical Characteristics,
T
j
= 25°C unless otherwise specified
Inverter Sector
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Collector Cutoff Current
I
CES
V
CE
= V
CES
, V
GE
= 0V
—
—
1.0
mA
Gate-Emitter Threshold Voltage
V
GE(th)
I
C
= 20mA, V
CE
= 10V
5
6
7
Volts
Gate Leakage Current
I
GES
V
GE
= V
GES
, V
CE
= 0V
—
—
0.5
µA
Collector-Emitter Saturation Voltage
V
CE(sat)
I
C
= 200A, V
GE
= 15V, T
j
= 25°C
—
1.7
2.1
Volts
I
C
= 200A, V
GE
= 15V, T
j
= 125°C
—
1.9
—
Volts
I
C
= 200A, V
GE
= 15V, Chip
—
1.6
—
Volts
Input Capacitance
C
ies
— — 27.0 nF
Output Capacitance
C
oes
V
CE
= 10V, V
GE
= 0V
—
—
2.7
nF
Reverse Transfer Capacitance
C
res
— — 0.8 nF
Total Gate Charge
Q
G
V
CC
= 300V, I
C
= 200A, V
GE
= 15V
—
530
—
nC
Inductive
Turn-on Delay Time
t
d(on)
— — 120 ns
Load
Turn-on Rise Time
t
r
V
CC
= 300V, I
C
= 200A,
—
—
150
ns
Switch
Turn-off Delay Time
t
d(off)
V
GE
= ±15V,
— — 350 ns
Time
Turn-off Fall Time
t
f
R
G
= 5.6Ω, I
E
= 150A,
—
—
600
ns
Reverse Recovery Time*
t
rr
Inductive Load Switching Operation
—
—
200
ns
Reverse Recovery Charge*
Qrr
—
5.0
—
µC
Emitter-Collector Voltage*
V
EC
I
E
= 200A, V
GE
= 0V, T
j
= 25°C
—
2.0
2.8
Volts
I
E
= 200A, V
GE
= 0V, T
j
= 125°C
—
1.95
—
Volts
I
E
= 200A, V
GE
= 0V, Chip
—
1.9
—
Volts
Thermal and Mechanical Characteristics,
T
j
= 25°C unless otherwise specified
Characteristics
Symbol
Test Conditions
Min.
Typ.
Max.
Units
Thermal Resistance, Junction to Case**
R
th(j-c)
Q
Per IGBT
—
—
0.17
°C/W
Thermal Resistance, Junction to Case**
R
th(j-c)
D
Per FWDi
—
—
0.33
°C/W
Contact Thermal Resistance**
R
th(c-f)
Thermal
Grease
Applied
— 0.015 — °C/W
Internal Gate Resistance
R
Gint
T
C
= 25°C
—
0
—
Ω
External Gate Resistance
R
G
3.0 — 30 Ω
*Represents characteristics of the anti-parallel, emitter-to-collector free-wheel diode (FWDi).
**T
C
, T
f
measured point is just under the chips.
34
0
0
0
0
33 32 31 30 29 28 27 26 25 24 23 22
Dimensions in mm (Tolerance: ±1mm)
21 20 19 18 17 16 15 14 13
12
35
36
1
2
3
4
11
10
9
8
7
6
5
IGBT FWDi NTC Thermistor
Chip Location (Top View)
17.4
22.9
33.9
44.9
55.9
79.4
92.4
106.0
39.7
24.4
U
P
V
P
W
P
W
N
V
N
U
N
Br
100.2
26.8
Th
22.9
33.9
44.9
55.9
79.4
91
.4
10
1.
8
18.3
28.0
35.0
U
P
V
P
W
P
W
N
Br
V
N
U
N
CHIP LOCATION (TOP VIEW)