C&H Technology CM600DXL-24S - Manual (Page 5)

CM600DXL-24S
Dual IGBTMOD™ NX-S Series Module
600 Amperes/1200 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
4 06/11 Rev. 3
Electrical Characteristics, T
j
= 25°C unless otherwise specified (continued)
NTC Thermistor Part
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Zero Power Resistance R
25
T
C
= 25°C *2 4.85 5.00 5.15 kΩ
Deviation of Resistance ∆R/R T
C
= 100°C, R
100
= 493Ω -7.3 — +7.8 %
B Constant B
(25/50)
Approximate by Equation *6 — 3375 — K
Power Dissipation P
25
T
C
= 25°C *2 — — 10 mW
Thermal Resistance Characteristics
Thermal Resistance, Junction to Case *2 R
th(j-c)
Q Per Inverter IGBT — — 0.033 K/W
Thermal Resistance, Junction to Case *2 R
th(j-c)
D Per Inverter FWDi — — 0.063 K/W
Contact Thermal Resistance, R
th(c-f)
Thermal Grease Applied — 0.007 — K/W
Case to Heatsink *2 (Per 1 Module) *7
Mechanical Characteristics
Mounting Torque M
t
Main Terminals, M6 Screw 31 35 40 in-lb
M
s
Mounting to Heatsink, M5 Screw 22 27 31 in-lb
Creepage Distance d
s
Terminal to Terminal — — — mm
Terminal to Baseplate — — — mm
Clearance d
a
Terminal to Terminal — — — mm
Terminal to Baseplate — — — mm
Weight m — 690 — Grams
Flatness of Baseplate e
c
On Centerline X, Y *8 ±0 — ±100 µm
Recommended Operating Conditons, T
a
= 25°C
(DC) Supply Voltage V
CC
Applied Across C1-E2 — 600 850 Volts
Gate (-Emitter Drive) Voltage V
GE(on)
Applied Across G1-Es1 / G2-Es2 13.5 15.0 16.5 Volts
External Gate Resistance R
G
Per Switch 0 — 6.8 Ω
*2 Case temperature (T C ) and heatsink temperature (T s ) is measured on the surface
(mounting side) of the baseplate and the heatsink side just under the chips.
Refer to the figure to the right for chip location.
The heatsink thermal resistance should be measured just under the chips.
*6 B (25/50) = In(
R 25
)/(
1
–
1
)
R 50 T 25 T 50
R 25 ; Resistance at Absolute Temperature T 25 [K]; T 25 = 25 [°C] + 273.15 = 298.15 [K]
R 50 ; Resistance at Absolute Temperature T 50 [K]; T 50 = 50 [°C] + 273.15 = 323.15 [K]
*7 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)].
*8 Baseplate (mounting side) flatness measurement points (X, Y) are shown in the figure below.
0
20.9
32.6
46.0
72.6
86.0
0
26.4
40.0
72.2
85.8
0
27.2 57.6 81.8 98.6
93.9 53.2 22.9
0 LABEL SIDE
Tr1 / Tr2: IGBT, Di1 / Di2: FWDi, Th: NTC Thermistor
Each mark points to the center position of each chip.
Di2
Th
Tr2
Di2
Tr2
Di2
Tr2
Di1
Tr1
Di1
Tr1
Di1
Tr1
– :
CONC
A
VE
+ :
CONVEX
– : CONCAVE
X
Y
+ : CONVEX
MOUNTING SIDE
LABEL SIDE
MOUNTING SIDE