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Vishay semiconductors, Thermal and mechanical specifications – C&H Technology VS-GB400TH120U User Manual

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VS-GB400TH120U

www.vishay.com

Vishay Semiconductors

Revision: 06-Mar-13

3

Document Number: 94789

For technical questions within your region:

[email protected]

,

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,

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 1 - IGBT Typical Output Characteristics

Fig. 2 - IGBT Typical Transfer Characteristics

Fig. 3 - IGBT Switching Loss vs. I

C

Fig. 4 - IGBT Switching Loss vs. R

g

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNITS

Maximum junction temperature range

T

J

-

-

150

°C

Storage temperature range

T

Stg

- 40

-

125

°C

Junction to case

IGBT

R

JC

-

-

0.047

K/W

Diode

-

-

0.096

Case to sink (Conductive grease applied)

R

CS

-

0.035

-

Mounting torque

Power terminal screw: M5

2.5 to 5.0

Nm

Mounting screw: M6

3.0 to 6.0

Weight

Weight of module

-

350

-

g

0

0

1

2

3

4

5

100

200

300

400

500

600

700

800

I

C

(A)

V

CE

(V)

V

GE

= 15 V

25 °C

125 °C

0

100

200

300

400

500

600

700

800

5

4

6

7

8

9

10

11

V

GE

(V)

I

C

(A)

125 °C

25 °C

V

CE

= 15 V

I

C

(A)

0

20

40

60

80

100

120

0

200

400

600

800

Eon

Eoff

V

GE

= ± 15 V

T

J

=

125 °C

R

g

= 2.2

Ω

V

CC

= 600 V

E

on

, E

of

f

(mJ)

R

g

(

Ω)

0

20

40

60

80

100

120

140

160

180

200

0

5

10

15

20

25

E

on

E

off

V

GE

= ± 15 V

T

J

= 125 °C

I

C

= 400 A

V

CC

= 600 V

E

on

, E

of

f

(mJ)