Vs-sa61ba60, Vishay semiconductors, Forward conduction – C&H Technology VS-SA61BA60 User Manual
Page 3: Recovery characteristics, Thermal and mechanical specifications
VS-SA61BA60
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Vishay Semiconductors
Revision: 29-Feb-12
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Document Number: 94688
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FORWARD CONDUCTION
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum DC output current
at case temperature
I
O
Resistive or inductive load
61
A
57
°C
Maximum peak, one-cycle
non-repetitive forward current
I
FSM
t = 10 ms
No voltage
reapplied
Initial T
J
=
T
J
maximum
300
A
t = 8.3 ms
310
t = 10 ms
100 % V
RRM
reapplied
250
t = 8.3 ms
260
Maximum I
2
t for fusing
I
2
t
t = 10 ms
No voltage
reapplied
442
A
2
s
t = 8.3 ms
402
t = 10 ms
100 % V
RRM
reapplied
313
t = 8.3 ms
284
Maximum I
2
t for fusing
I
2
t
I
2
t for time t
x
= I
2
t x t
x
0.1 t
x
10 ms, V
RRM
= 0 V
4.4
kA
2
s
Value of threshold voltage
V
F(TO)
T
J
maximum
0.914
V
Forward slope resistance
r
t
10.5
m
Maximum forward voltage drop
V
FM
T
J
= 25 °C, I
FM
= 30 A
pk
t
p
= 400 μs
1.33
V
T
J
= T
J
maximum, I
FM
= 30 A
pk
1.23
RMS isolation voltage base plate
V
INS
f = 50 Hz, t = 1 s
3000
RECOVERY CHARACTERISTICS
PARAMETER
SYMB
OL
TEST CONDITIONS
VALUES
UNITS
Reverse recovery time, typical
t
rr
T
J
= 25 °C, I
F
= 20 A, V
R
= 30 V,
dI
F
/dt = 100 A/μs
170
ns
T
J
= 125 °C, I
F
= 20 A, V
R
= 30 V,
dI
F
/dt = 100 A/μs
250
Reverse recovery current,
typical
I
rr
T
J
= 25 °C, I
F
= 20 A, V
R
= 30 V,
dI
F
/dt = 100 A/μs
10.5
A
T
J
= 125 °C, I
F
= 20 A, V
R
= 30 V,
dI
F
/dt = 100 A/μs
16
Reverse recovery charge,
typical
Q
rr
T
J
= 25 °C, I
F
= 20 A, V
R
= 30 V,
dI
F
/dt = 100 A/μs
900
nC
T
J
= 125 °C, I
F
= 20 A, V
R
= 30 V,
dI
F
/dt = 100 A/μs
1970
Snap factor, typical
S
T
J
= 25 °C
0.6
-
Junction capacitance, typical
C
T
V
R
= 600 V
67
pF
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Junction and storage
temperature range
T
J
, T
Stg
- 55 to 150
°C
Maximum thermal resistance
junction to case per bridge
R
thJC
0.30
°C/W
Typical thermal resistance,
case to heatsink per module
R
thCS
Mounting surface, smooth, flat and greased
0.05
Approximate weight
30
g
Mounting torque ± 10 %
Bridge to heatsink
1.3
Nm
Case style
SOT-227
I
FM
t
rr
dI
R
dt
I
RM(REC)
Q
rr
t