C&H Technology DTO25 - Manual (Page 3)

Document Number: 51054 For technical questions, contact: [email protected] www.vishay.com
Revision: 19-Jan-09 15
DTO25
Surface Mounted Power Resistor
Thick Film Technology
Vishay Sfernice
Preliminary
POWER RATING CHART
The temperature of the case should be maintained within the limits specified.
SPECIAL FEATURES
Resistance Values
≥ 0.016 ≥ 0.1 ≥ 0.5
Typical Temperature Coefficient
(- 55 °C to + 150 °C)
± 800 ppm/°C ± 250 ppm/°C ± 150 ppm/°C
PERFORMANCE
TESTS CONDITIONS REQUIREMENTS
Momentary Overload
IEC 60115-1 § 4.13
1.5 Pr/5 s
Us
≤ 1.5 U
L
± (0.25 % + 0.005 Ω)
Rapid Temperature Change
IEC 60115-1
Tests Na
5 cycles - 1 h
- 55 °C to + 150 °C
± (0.5 % + 0.005
Ω)
Load Life
IEC 60115-1
1000 h Pr at + 25 °C case temperature
± (1 % + 0.005
Ω)
Humidity (Steady State)
IEC 60115-1
IEC 60068-2-3
Test Ca: 56 days RH 95 % 85 °C
± (0.5 % + 0.005 Ω)
Vibration
IEC 60115-1
IEC 60068-2-6
Test Fc: 10 to 2000 Hz
± (0.2 % + 0.005
Ω)
Shear (Adhesion) Test
IEC 60115-1
IEC 60068-2-21
Test Ue3/Shear: 5 N/10 s
No visible damage
Substrate Bending Test
IEC 60115-1
IEC 60068-2-21
Test Ue1: 2 mm/3 times
± (0.25 % + 0.005 Ω)
ASSEMBLY SPECIFICATIONS
For the assembly on board, we recommend the lead (Pb)-free thermal profile as per J-STD-020C
TESTS CONDITIONS REQUIREMENTS
Resistance to Soldering Heat
IEC 60115-1
IEC 60068-2-58
Solder Bath method: 270 °C/10 s
± (0.5 % + 0.005 Ω)
Moisture Sensitivity Level (MSL)
IPC/JEDEC J-STD-020C
85 °C/85 % RH/168 h
Level: 1
+ Pass requirements of TCR
Overload and Dielectic Strength after MSL
50 25 0
100
CASE TEMPERATURE IN °C
% OF RA
TED DISSIP
A
TION 80
60
40
20
0
100 150 200