C&H Technology RM1200DB-66S - Manual (Page 4)

MITSUBISHI ELECTRIC CORPORATION
HIGH VOLTAGE DIODE MODULE HVM-2019 (HV-SETSU)
PAGE
3 / 10
8. Thermal Characteristics
Limits
Item Symbol Conditions
Min. Typ. Max.
Unit
8.1 Thermal resistance R
th(j-c)R
Junction to case
(per 1/2 module)
— — 18.0 K/kW
8.2 Contact thermal resistance R
th(c-f)
Case to fin
(Note 2)
Conductive grease applied
(per 1/2 module) — 16.0 — K/kW
Note 2: Thermal conductivity is 1W/mK with a thickness of 100µm.
9. Mechanical
Characteristics
Limits
Item Symbol Conditions
Min. Typ. Max.
Unit
9.1 Mounting torque — Main terminal screw : M8 7.0 — 13.0 N·m
9.2 Mounting torque — Mounting screw : M6 3.0 — 6.0 N·m
9.3 Mass — — — 1.5 — kg
9.4 Comparative tracking index CTI — 600 — — —
9.5 Clearance — — 19.5 — — mm
9.6 Creepage distance — — 32 — — mm
9.7 Internal inductance L
A-K(int)
— — 35 — nH
9.8 Internal lead resistance R
A-K(int)
T
c
= 25 °C — 0.25 — mΩ
10. Shipping Inspection Report Item
(note 3)
Static characteristics : I
RRM
[7.1], V
FM
[7.2]
Dynamic characteristics : t
rr
[7.3], Q
rr
[7.5]
Note 3: One shipping inspection report with the above item values is submitted when modules are delivered. The test
conditions are defined in bracket.