Conclusions – A P Products Meritec Through Hole Products Using Lead-Free Solder User Manual
Page 8
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8
Conclusions
Good results were achieved with the profile on page 5 using the materials defined on
page 3. Though the new lead-free solder alloys do not flow and wet as well as lead-
bearing alloys, the solder joints were quite acceptable based on the new proposed
standards.
Fig. 1 on page 6 is typical of the results to be expected with the new lead-free alloys.
Fig 2 illustrates how the new alloys and plating materials result in a smaller fillet on the top
side of the board.
Though Fig 3 is quite acceptable to the new standards, the entire pad did not wet. This
could have easily been improved with the use of a thieving pad located adjacent to the
one in the photo.
The photo on page 7 is an X-ray. A solder void has been circled there for reference.
During these tests, 3 or 4 of these appeared on both the Pb-free and Pb tests, and are
very acceptable.
The recommended wave profile for all Meritec through hole products is the one shown on
page 5. This, when combined with a good solder alloy and flux chemistry should result in
a good starting point.