Ramsey Electronics MR6 - Manual (Page 6)

MR6
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the solder (see the associated diagrams).
Another commonly used technique is to glue the surface mount components
to the printed circuit board before soldering. The procedure is to take a small
amount of glue (usually with a pin or toothpick) and “dab” the circuit board in
the place where the component will be affixed. Be careful not to apply too
much glue as when the part is placed it may “squash” the glue underneath
the soldering tabs of the component. Carefully place the part into position,
and when the glue
dries, solder the
connection.
This may go a little “against the grain” at first, but it is by far the easiest
method. Notice also that when reheating the solder that the iron tip does not
come in contact with the “tab” on the body of the chip component. Over heat-
ing of this solder tab can cause a fracture of the bond to the component,
causing an intermittent connection.