Philips BGY280 - Manual (Page 9)

2000 Nov 15 9
Philips Semiconductors Preliminary specification
UHF amplifier module BGY280
PACKAGE OUTLINE SOT559A
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
00-01-31
00-09-28
IEC JEDEC EIAJ
SOT559A
0 5 10 mm
scale
Leadless surface mounted package; plastic cap; 16 terminations SOT559A
A
c
E1
D
1 2 3
11
12
13
14
15
16
10 9
4
5
6
7
8
D1
E
e1
L (12 ×) b (12 ×)
L1 (4×)
e2
e2
e
e
e1
pin 1 index
UNIT
mm
1.1
0.9 3.5
3.3 1.9
1.5
2.6 4.4
b b1
2.9
2.7
b2
DIMENSIONS (mm are the original dimensions)
A
5.275
5.075
b3
4.2
4.0
b4
1.2
1.0
b5
0.625
0.425
b6
0.8
0.6
b7
0.9
0.7
b8
14.05
13.45
D
0.55
0.45
c
13.6
13.3
D1
11.3
10.7
E e
3.3
e1
10.85
10.55 1.1
0.9
E1 e2 L
2.6
2.4
Z
1.6
1.4
L1
2.5
2.3
Z1
0.6
0.4
L2
1.6
1.4
L3
3.5
3.3
Z2
2.9
2.7
Z3
1.1
0.9
Z4
1.5
1.3
Z5
1.1
0.9
Z6
3.8
3.6
Z7
1.5
1.3
Z8
Z (2 ×)
Z1 (2×)
L3 (4×)
Z5
(4 ×)
b6 (4×)
b1 (2×) b5 (4×) b3 (4×)
b8 (4×)
b7 (4×)
b4
(4 ×)
b2
(2 ×)
Z4 (12×) Z6 (12×)
Z2 (2×)
Dimensions solderresist
L2
(4 ×)
Z8 (6×)
Z7 (6×)
Z3
(2 Ч)