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Package outline, Bga6489, Nxp semiconductors – Philips BGA6489 User Manual

Page 10: Mmic wideband medium power amplifier

background image

BGA6489_2

© NXP B.V. 2009. All rights reserved.

Product data sheet

Rev. 02 — 15 June 2009

10 of 13

NXP Semiconductors

BGA6489

MMIC wideband medium power amplifier

9.

Package outline

Fig 11. Package outline SOT89 (SC-62)

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

DIMENSIONS (mm are the original dimensions)

SOT89

TO-243

SC-62

06-03-16
06-08-29

w

M

e

1

e

E

H

E

B

B

0

2

4 mm

scale

b

p3

b

p2

b

p1

c

D

L

p

A

Plastic surface-mounted package; collector pad for good heat transfer; 3 leads

SOT89

1

2

3

UNIT

A

mm

1.6
1.4

0.48
0.35

c

0.44
0.23

D

4.6
4.4

E

2.6
2.4

HE

Lp

4.25
3.75

e

3.0

w

0.13

e1

1.5

1.2
0.8

bp2

bp1

0.53
0.40

bp3

1.8
1.4