Package outline, Bga6489, Nxp semiconductors – Philips BGA6489 User Manual
Page 10: Mmic wideband medium power amplifier
BGA6489_2
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 02 — 15 June 2009
10 of 13
NXP Semiconductors
BGA6489
MMIC wideband medium power amplifier
9.
Package outline
Fig 11. Package outline SOT89 (SC-62)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
DIMENSIONS (mm are the original dimensions)
SOT89
TO-243
SC-62
06-03-16
06-08-29
w
M
e
1
e
E
H
E
B
B
0
2
4 mm
scale
b
p3
b
p2
b
p1
c
D
L
p
A
Plastic surface-mounted package; collector pad for good heat transfer; 3 leads
SOT89
1
2
3
UNIT
A
mm
1.6
1.4
0.48
0.35
c
0.44
0.23
D
4.6
4.4
E
2.6
2.4
HE
Lp
4.25
3.75
e
3.0
w
0.13
e1
1.5
1.2
0.8
bp2
bp1
0.53
0.40
bp3
1.8
1.4
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