Package outline, Tda8566, Nxp semiconductors – Philips TDA8566 User Manual
Page 13: 2× 40 w/2 ω stereo btl car radio power amplifier
TDA8566_6
© NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 06 — 15 October 2007
13 of 21
NXP Semiconductors
TDA8566
2
×
40 W/2
Ω
stereo BTL car radio power amplifier
14. Package outline
Fig 10. Package outline SOT418-3 (HSOP20)
UNIT
A4
(1)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
+
0.08
−
0.04
3.5
0.35
DIMENSIONS (mm are the original dimensions)
Notes
1. Limits per individual lead.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
SOT418-3
0
5
10 mm
scale
HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height
SOT418-3
A
max.
detail X
A2
3.5
3.2
D2
1.1
0.9
HE
14.5
13.9
Lp
1.1
0.8
Q
1.7
1.5
2.5
2.0
v
0.25
w
0.25
y
Z
8
°
0
°
θ
0.07
x
0.03
D1
13.0
12.6
E1
6.2
5.8
E2
2.9
2.5
bp
c
0.32
0.23
e
1.27
D
(2)
16.0
15.8
E
(2)
11.1
10.9
0.53
0.40
A3
A4
A2
(A3)
Lp
θ
A
Q
D
y
x
HE
E
c
v
M
A
X
A
bp
w
M
Z
D1
D2
E2
E1
e
20
11
1
10
pin 1 index
02-02-12
03-07-23