Intel CELERON 200 - Manual (Page 3)

Thermal and Mechanical Design Guidelines 3
Contents
1 Introduction .....................................................................................................7
1.1 Document Goals and Scope .....................................................................7
1.1.1 Importance of Thermal Management ............................................7
1.1.2 Document Goals........................................................................7
1.1.3 Document Scope .......................................................................8
1.2 Reference Documents .............................................................................9
1.3 Definition of Terms .................................................................................9
2 Processor Thermal/Mechanical Information .........................................................11
2.1 Mechanical Requirements ......................................................................11
2.1.1 Processor Package...................................................................11
2.1.2 Heatsink Attach ......................................................................16
2.2 Thermal Requirements ..........................................................................18
2.2.1 Processor Junction Temperature ................................................19
2.3 Heatsink Design Considerations..............................................................19
2.3.1 Heatsink Size..........................................................................20
2.3.2 Heatsink Mass ........................................................................21
2.3.3 Thermal Interface Material........................................................21
2.4 System Thermal Solution Considerations .................................................22
2.4.1 Chassis Thermal Design Capabilities...........................................22
2.4.2 Improving Chassis Thermal Performance ....................................22
2.4.3 Summary...............................................................................25
3 Thermal Metrology ..........................................................................................27
3.1 Characterizing Cooling Performance Requirements ....................................27
3.1.1 Example ................................................................................29
3.2 Local Ambient Temperature Measurement Guidelines.................................30
3.3 Processor Power Measurement Metrology Recommendation ........................32
3.3.1 Sample Preparation .................................................................33
4 System Thermal/Mechanical Design Information..................................................37
4.1 Overview of the Reference Design...........................................................37
4.1.1 Altitude..................................................................................37
4.1.2 Heatsink Thermal Validation .....................................................37
4.2 Environmental Reliability Testing ............................................................38
4.2.1 Structural Reliability Testing .....................................................38
4.2.2 Power Cycling .........................................................................40
4.2.3 Recommended BIOS/CPU/Memory Test Procedures ......................40
4.3 Material and Recycling Requirements ......................................................40
4.4 Safety Requirements ............................................................................41
4.5 Reference Attach Mechanism..................................................................41
4.5.1 Structural Design Strategy .......................................................41
4.5.2 Mechanical Interface to the Reference Attach Mechanism ..............41