Intel CELERON 200 User Manual
Page 12

Processor Thermal/Mechanical Information
12
Thermal and Mechanical Design Guidelines
Table 1. Micro-FCBGA Package Mechanical Specifications
Symbol Parameter
Min Max Unit Figure
B1
Package substrate width
34.95
35.05
mm
B2
Package substrate length
34.95
35.05
mm
C1 Die
width
11.1
C2 Die
length
8.2
F2
Die height (with underfill)
F3
Package overall height
(package substrate to
die)
2.022 Max
mm
G1
Width (first ball center to
last ball center)
31.75 Basic
mm
G2
Length (first ball center
to last ball center)
31.75 Basic
mm
J1
Ball pitch (horizontal)
1.27 Basic
mm
J2
Ball pitch (vertical)
1.27 Basic
mm
M
Solder Resist Opening
0.61
0.69
mm
N
Ball
height
0.6 0.8 mm
--
Corner Keep-out zone at
corner (4X)
7 × 7
mm
--
Keep-out from edge of
package (4X)
5 mm
--
Package edge to first ball
center
P
die
Allowable pressure on
the die for thermal
solution
689 kPa
W Package
weight
6
g
NOTE:
1.
All dimensions are subject to change.
2.
Overall height as delivered. Values were based on design specifications and tolerances.
Final height after surface mount depends on OEM motherboard design and SMT
process.