2 block diagram, 3 inter-die bonding – Rainbow Electronics ATA6286 User Manual
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4958AS–AUTO–09/06
ATA6285/ATA6286 [Preliminary]
2.2
Block Diagram
Figure 2-2.
ATA6285/ATA6286 Block Diagram (MCP)
2.3
Inter-die Bonding
The ATA6285/ATA6286 are Smart RF Micro Transmitter ICs in MCP (Multi Chip Package) tech-
nology.
shows the internal assembly of the MCP.
VSRF
PB7 (NSS)
VCC
PB5 (SCK)
PB4 (MISO)
PB0 (T3ICP)
PB1 (T3O)
PB6
PD0 (T2ICP)
PD1 (T3I)
PD7 (SDIN)
NRESET
GNDRF
GND
PD2 (INT
O)
PB2 (T2I)
Sensor
interface/
input
multiplexer
Timer block
Oscillator
AVR Core
SRAM
IO Ports
debugWIRE
Flash
EEPROM
ANT2
ANT1
XTO2
XTO1
LF1
PB3 (MOSI)
PC0
PC1
PC2
S2
S1
S0
LF2
VCO
RF
Transmitter
Power
amplifier
XTO
PLL
SPI
ECIN1
CLOCK
Power
Supervision
POR/ BOD/
TSD and
RESET
Clock
management
and
monitoring
Voltage
monitor
Watchdog
oscillator
Watchdog
timer
Temperature
sensor
LF Receiver
125 kHz
FSK
ASK
Table 2-1.
Inter-die Connection Description of the MCP
AVR – Pin
ATA5756/ATA5757 – Pin
PD3 (INT1) – External interrupt input 1
EN – Enable input
PD4 (ECIN1) – External clock input 1
CLK – Clock output signal
PD5 (T2O1) – Timer2 modulator output 1
ASK – Input signal
PD6 (T2O2) – Timer2 modulator output 2
FSK – Input signal