Lanner LEC-2250 - Manual (Page 19)

18
Hardware Setup
Chapter 4
Embedded and Industrial Computing
Uninstalling the heat sink by unscrewing
the screws from the side of the chassis
Chapter 4:
Hardware Setup
Preparing the Hardware Installation
To access some components and perform certain service
procedures, you must perform the following procedures
first.
WARNING: To reduce the risk of personal injury,
electric shock, or damage to the equipment,
remove the power cord to remove power from the
server. The front panel Power On/Standby button
does not completely shut off system power.
Portions of the power supply and some internal
circuitry remain active until AC power is removed.
Unpower the LEC-2250 and remove the power cord. 1.
Unscrew the 4 rubber feet from the bottom cover of 2.
the LEC-2250 System.
Open the cover. 3.
Installing the System Memory
The motherboard supports DDR3 memory to meet the
higher bandwidth requirement of the latest operating
system and Internet applications. It comes with one
double data rate type three (DDR3) Small Outline Dual
Inline Memory Modules (SO-DIMM) socket.
Note:
The motherboards can support up to 4 GB 1.
memory capacity in maximum.
The CF has to be installed first (if it is needed) 2.
before you install the RAM due to space
contention.
You will need to take off the heat sink first to 3.
access the SO-DIMM slot.
Installing the SO-DIMM