Lanner VES-270 - Manual (Page 4)

4
Introduction
Chapter 1
Embedded and Industrial Computing
Chapter 1:
Introduction
Thank you for choosing the VES-270. The VES-270 is
Lanner’s flagship COM Express R2.0 Type 6 module.
It features the new Core i7/i3 processors with QM77
chipset.
This COM Express module provides a rich I/O capabilities
via high-bandwidth interfaces such as PCI Express, Serial
ATA 2.0/3.0, and Hi-Speed USB 2.0/3.0 connectivity.
Other I/O capabilities include general-purpose I/O
(GPIO), SMbus, and displays supporting LVDS, HDMI, DVI
and DisplayPort as well as Intel® 82579LM (PHY) Gigabit
Ethernet.
System Specification
System
CPU Intel® Core™ i7 / i3 (FCBGA 1023) Processors
BIOS AMI 64Mbit SPI BIOS
System Chipset Intel® QM77 Express Chipset
System Memory
Two 204-pin DDR3 SODIMM Sockets, Supports Up to
16GB DDR3 1333/ 1600 SDRAM
Expansion 7 PCIe x1, 1 PCIe x16
I/O
MIO 4 SATA ports, SMbus
USB 8 x USB 2.0, 4 x USB 3.0
DIO 4-bit GPI and 4-bit GPO
Display
Chipset Intel® QM77 Chipset Integrated
Memory DVMT 5.0 Up to 512 MB
Resolution
CRT Mode: 2048 x 1536
LCD / Simultaneous Mode: 1920 x 1200
Display Supported HDMI, DVI, DisplayPort
LVDS Interface Dual-channel 18/ 24-bit LVDS
Audio Interface
Chipset Intel® QM77 Integrated
Interface Intel® High Definition Audio
Ethernet
LAN Chip Intel® 82579LM (PHY) Gigabit Ethernet
Ethernet Interface 10/ 100/ 1000 Base-Tx Gigabit Ethernet Compatible
Mechanical & Environmental
Power Requirement +9 ~ +19 V
ACPI
Single Power ATX Support S0, S3, S4, S5, ACPI 3.0
Compliant
Power Type AT / ATX
Operating Temperature 0 ~ 60°C (32 ~ 140°F)
Storage Temperature -40 ~ 75°C (-40 ~ 167°F)
Operating Humidity 0% ~ 90% Relative Humidity, Non-condensing
Size (L x W) 125 mm x 95 mm (5” x 3.7”)
Weight 0.2 kg (0.44 lbs)
Ordering Information
VES-270-7A COM Express® R2.0 Type 6 Module with Intel® Core TM i7-
3517UE CPU and QM77 Chipset
VES-270-3A
COM Express® R2.0 Type 6 Module with Intel® Core TM i3-
3120ME CPU and QM77 Chipset