DFI HD171-H81 - Manual (Page 6)

6
Rear Panel I/O
Ports • 1 12V (HD171) or 19~24V (HD173) DC-in jack
or 4-pin power connector* (optional)
• 1 DB-9 RS232 serial port
• 1 VGA port
• 1 DP port (default) or 1 mini-DIN-6 PS/2 keyboard/mouse port* (optional)
• 1 DVI-D port
• 2 RJ45 LAN ports
• 2 USB 2.0 ports
• 2 USB 3.0 ports
• Mic-in, line-in and line-out jacks
I/O Connectors • 2 connectors for 4 external USB 2.0 ports
• 1 connector for 1 external USB 2.0 port or
1 vertical USB 2.0/1.1 port* (optional)
• 3 connectors for 3 external serial ports (2.0mm pitch)
- 1 RS422/485
- 2 RS232
• 1 8-bit Digital I/O connector
• 1 front audio connector for line-out and mic-in jacks
• 1 LPC connector
• 2 Serial ATA connectors
• 2 Serial ATA power connectors
• 1 chassis intrusion connector
• 1 front panel connector
• 2 fan connectors
Energy Efficient
Design • Supports ErP Lot6 power saving* (optional)
• Supports ACPI
• System Power Management
• Wake-On-Events include:
- Wake-On-PS/2 KB/Mouse* (optional)
- Wake-On-USB KB/Mouse
- Wake-On-LAN
- RTC timer to power-on the system
• CPU stopped clock control
• AC power failure recovery
Power
Consumption • HD171-H81N: 35.28W with i7-4770TE at 2.3GHz and 2x 8GB DDR3 SODIMM
OS Support • Windows XP Professional x86 & SP3 (32-bit) (limited function)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
Temperature • Operating: 0 o C to 60 o C
• Storage: -20 o C to 85 o C
Humidity • 10% to 90%
Dimensions • Mini-ITX form factor
• 170mm (6.7") x 170mm (6.7")
Chapter 1 - Introduction
Specifications
Processor • LGA 1150 socket for:
- 4th Generation Intel ® Core TM processors (22nm process technology)
: Intel ® Core TM i7-4770TE (8M Cache, up to 3.3 GHz); 45W
: Intel ® Core TM i5-4590T (6M Cache, up to 3.0 GHz); 35W
: Intel ® Core TM i5-4570TE (4M Cache, up to 3.3 GHz); 35W
: Intel ® Core TM i3-4350T (4M Cache, 3.1 GHz); 35W
: Intel ® Core TM i3-4340TE (4M Cache, 2.6 GHz); 35W
: Intel ® Core TM i3-4330TE (4M Cache, 2.4 GHz); 35W
: Intel ® Pentium ® G3320TE (3M Cache, 2.3 GHz); 35W
: Intel ® Celeron ® G1820TE (2M Cache, 2.2 GHz); 35W
Chipset • Intel ® H81 Express Chipset
Super I/O
Address • NCT6106/4Eh
System Memory • Two 204-pin DDR3 SODIMM sockets
• Supports DDR3 1333/1600MHz
• Supports up to 16GB system memory
• Supports dual channel memory interface
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
Expansion
Interfaces • 1 PCIe x16 Gen 3 slot (PCIe 3.0)
• 1 Mini PCIe slot
- Supports USB and PCIe signals
- Supports mSATA
- Supports full size Mini PCIe card
Graphics • Intel ® HD Graphics
• Display ports: 1 DP, 1 DVI-I (DVI-D signal), 1 VGA
• DP: supports DP++, resolution up to 3840x2160 @ 60Hz
• DVI-D, VGA: resolution up to 1920x1200 @ 60Hz
• Supports 6 Graphics Execution Units (EUs)
• Intel ® Clear Video Technology
• DirectX Video Acceleration (DXVA) support for accelerating video processing
Audio • Realtek ALC888 5.1-channel High Definition Audio
LAN • Intel ® I210 PCI Express Gigabit Ethernet controller
• Intel ® I217 Gigabit Ethernet Phy
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Serial ATA • 2 SATA 3.0 ports with data transfer rate up to 6Gb/s
Trusted
Platform
Module - TPM*
(optional) • Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Damage Free
Intelligence • Monitors CPU/system temperature and overheat alarm
• Monitors Vcore/+5V/+12V/+3.3V/3VSB/VBAT
• Monitors CPU/system fan speed and failure alarm
• Read back capability that displays temperature, voltage and fan speed
• Watchdog timer function
BIOS • AMI BIOS
- 64Mbit SPI BIOS
Chapter 1
Chapter 1 Introduction www.dfi.com
Note:
*Optional and is not supported in standard model. Please contact your sales represen-
tative for more information.