Zilog Z8PE002 - Manual (Page 3)

Packaging
Product Specification
PS007231-1112 iii
Table of Contents
Table of Contents................................................................................................................................................................ iii
Marketing Drawings ............................................................................................................................................................. 1
Marketing Outline, 8-Lead PDIP ...................................................................................................................................... 2
Marketing Outline, 18-Lead PDIP .................................................................................................................................... 3
Marketing Outline, 20-Lead PDIP .................................................................................................................................... 4
Marketing Outline, 28-Lead PDIP .................................................................................................................................... 5
Marketing Outline, 40-Lead PDIP .................................................................................................................................... 6
Marketing Outline, 48-Lead PDIP .................................................................................................................................... 7
Marketing Outline, 64-Lead PDIP .................................................................................................................................... 8
Marketing Outline, 28-Lead Plastic Chip Carrier ............................................................................................................. 9
Marketing Outline, 44-Lead Plastic Chip Carrier ........................................................................................................... 10
Marketing Outline, 68-Lead Plastic Chip Carrier ........................................................................................................... 11
Marketing Outline, 84-Lead Plastic Chip Carrier ........................................................................................................... 12
Marketing Outline, 80-Lead Plastic Quad Flatpack ....................................................................................................... 13
Marketing Outline, 100-Lead Plastic Quad Flatpack ...................................................................................................... 14
Marketing Outline, 32-Lead LQFP ................................................................................................................................. 15
Marketing Outline, 44-Lead LQFP ................................................................................................................................. 16
Marketing Outline, 64-Lead LQFP ................................................................................................................................. 17
Marketing Outline, 64-Lead LQFP ................................................................................................................................. 18
Marketing Outline, 80-Lead LQFP ................................................................................................................................. 19
Marketing Outline, 100-Lead LQFP ............................................................................................................................... 20
Marketing Outline, 144-Lead LQFP ............................................................................................................................... 21
Marketing Outline, 8-Lead SOIC ................................................................................................................................... 22
Marketing Outline, 18-Lead SOIC ................................................................................................................................. 23
Marketing Outline, 20-Lead SOIC ................................................................................................................................. 24
Marketing Outline, 28-Lead SOIC ................................................................................................................................. 25
Marketing Outline, 20-Lead SSOP ................................................................................................................................. 26
Marketing Outline, 28-Lead SSOP ................................................................................................................................. 27
Marketing Outline, 48-Lead SSOP ................................................................................................................................. 28
Marketing Outline, 144-Lead BGA ................................................................................................................................ 29
Marketing Outline, 8-Lead QFN .................................................................................................................................... 30
Marketing Outline, 20-Lead QFN .................................................................................................................................. 31
Marketing Outline, 28-Lead QFN .................................................................................................................................. 32
Marketing Outline, 32-Lead QFN .................................................................................................................................. 33
Marketing Outline, 44-Lead QFN .................................................................................................................................. 34
ZHX1810 ........................................................................................................................................................................ 35
ZHX1820 ........................................................................................................................................................................ 36
Packing Quantity ................................................................................................................................................................ 37
Package Migration .............................................................................................................................................................. 38
18/20-Lead PDIP Migration ........................................................................................................................................... 38
28-Lead PDIP Migrations ............................................................................................................................................... 39
40/44/48-Lead Migration ................................................................................................................................................ 40
100/144-Lead Migration ................................................................................................................................................. 41