NEXCOM ICES 668 - Manual (Page 16)

Copyright © 2012 NEXCOM International Co., Ltd. All Rights Reserved. 2 ICEK 668-T6 Starter Kit User Manual
Chapter 1: Product Introduction
Hardware Specifications
CPU Support
▪ Support Intel® BGA 1023, 3rd generation Intel® Core™ processor
– Intel® Core™ i7 3615QE (4C/ 6M cache/ 2.3GHz/ Max. TDP 45W)
– Intel® Core™ i7 3555LE (2C/ 4M cache/ 2.5GHz/ Max. TDP 25W)
– Intel® Core™ i7 3517UE (2C/ 4M cache/ 1.7GHz/ Max. TDP 17W)
– Intel® Core™ i3 3217UE (2C/ 3M cache/ 1.6GHz/ Max. TDP 17W)
– Intel® Core™ i5 3610ME (2C/ 3M cache/ 2.7GHz/ Max. TDP 35W)
Main Memory
▪ Dual DDR3/ SO-DIMMs, support 1333/1600MHz ECC system memory
up to 16GB
Platform Control Hub
▪ Intel® QM77 PCH chipset
BIOS
▪ AMI System UEFI BIOS
▪ Plug and play support
▪ Advanced power management and advanced configuration & power
interface support
Display
▪ Intel® HD graphics with DX11 support up to triple independent displays
▪ One PCI Express x16 Lane down to the carried board
▪ Supports VGA and single/dual channel s 18/24 bit LVDS interface
▪ 3x DDI (Digital Display Interface) supports HDMI/ DVI, DisplayPort and
SVDO interfaces
Audio
▪ HD audio interface
On-board LAN
▪ Intel® 82579LM Gigabit Ethernet, support iAMT 8.0
▪ Support PXE boot from LAN, wake on LAN function
▪ Signals down to I/O board
COM Express Connector
▪ AB
VGA/ LVDS/ 8x USB 2.0 / 2x Serial Port / HD Audio/ 4x SATA/ GbE/ GPIO/
LPC bus, 1x PCIe X4/ 3x PCIe X1/ SMBus (I2C)/ SPI BIOS /SPK out
▪ CD
PCIe x16/ 3x DDI/ 4x USB 3.0
Power Requirements
▪ +12V, +5VSB, +3.3V RTC power
Dimensions
▪ 95mm (W) x 125mm (L)
Environment
▪ Board level operating temperatures: 0°C to 60°C
▪ Storage temperatures: -20°C to 80°C
▪ Relative humidity:
10% to 90% (operating, non-condensing)
5% to 95% (non-operating, non-condensing)
Certifications
▪ Meet CE
▪ FCC Class A