Kontron COMe-bP5020 Introduction - Manual (Page 13)

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User Guide
COMe-bP5020
1.5 Related Publications
Table 3: Related Publications
NOTICE
Kontron performs comprehensive environmental testing of its products in accordance with
applicable standards.
Customers desiring to perform further environmental testing of Kontron products must con-
tact Kontron for assistance prior to performing any such testing. This is necessary, as it is
possible that environmental testing can be destructive when not performed in accordance
with the applicable specifications.
In particular, for example, boards without conformal coating must not be exposed to a
change of temperature exceeding 1K / minute, averaged over a period of not more than five
minutes. Otherwise, condensation may cause irreversible damage, especially when the board
is powered up again.
Kontron does not accept any responsibility for damage to products resulting from destructive
environmental testing.
SPECIFICATION /
ORGANIZATION
PUBLICATION
COM Express® PICMG® COM.0, COM Express® Module Base Specif ication, Revision 2.0, August 8, 2010
Freescale™, Kontron and Emerson Common Pinout Def inition
PCI Express PCI Express Base Specification Revision 2.0, Dec. 20, 2006
Serial RapidIO RapidIO™ Interconnect Specification Part 6: LP-Serial Physical Layer Specification,
Rev. 2.0.1, March 2008
Serial ATA Serial ATA International Organization: Serial ATA Revision 2.6, 15th February 2007
Ethernet IEEE802.3: Part 3: Carrier Sense Multiple Access with Collision Detection (CSMA/CD) Access
Method and Physical Layer Specification, Clause 22 and Clause 45
Platform Firmware DENX “U-Boot” (Universal Boot Loader) online documentation at www.denx.de
Kontron Kontron’s Product Safety and Implementation Guide, ID 1021-9142