BeStar SMT5555-03H2.5LF - Manual (Page 5)

min.110s
50
150
100
200
T
emp
e
ra
tu
re
[
℃
]
ramp up to
150℃
min.3k/s
50 0
0
100
min.190℃
time [s]
200 150 250
ramp down
from T(solid)
min.6k/s
350 300 400
max.90s
Temperature profile for a lead-free reflow process
min.300s
250
300
max.260℃
T(solid)min.217
℃
max.255℃
min.40s
1 2 3 4 5 6
H
G
F
E
H
G
F
E
Follwing soldering conditions are recommend;Refer to Fig.1
In automated mounting of The SMD Sound Transducers on printed circuit boards,any
bending,expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept minimum to preven them from electrical failures and mechanical damages of the
devices.
Soldering(Reflow)
(1)Solderings of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for"Reflow Solderings"
(3)In the reflow solderings,too high soldering temperatures and too large tempearture
gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
4.Surface Mounting Condition
D
C
B
Checked by:
Drawn by:
Date:
D
C
B
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
Page:4 of 7
1 2
Approved by:
4 3
Note Drawn
5
www.be-star.com [email protected]
Date
REV.
6
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BS/TET01.552A
SMT5555-03H2.5 LF
SMT5555-03H2.5 LF
A 08/09/20 魏奉玲
08/09/20
魏奉玲
徐 波
陶红仲
Notice: After reflow soldering test the part shall meet specifications without any
degrance and performance except S.P.L, S.P.L shall be 85dB or more.