BeStar BSP1109-05H1.7 LF - Manual (Page 5)

200
400-560 Leader
Cover Film
The cover film peel strength force 0.1-0.7N
The cover film peel speed 300mm/min.
0.3 ±0.05
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1
.5
6
REV.
A
B
C
240~280
Trailer160-200
100
0
.5
13
0
.2
5
Drawn Date Note
25.5
Date:
www.be-star.com [email protected]
Approved by:
4
Drawn by:
Checked by:
3
Empty
330 Max
Diameter
33.5 Max
Dimensions of reel
Components
13
.8
±0
.1
4.1 packing drawing
4. Tape on Reel Packing
D
E
F
G
Dimensions of carrier tape
12 ±0.1
1.5
+0
.1
0
9.8 ±0.1
11
.8
±0
.1
A A
4 ±0.1
2 ±0.1
24
±
0
.1
1
.75
±0
.1
11
.5
±0
.1
B
B
B-B
0
0 100 50 150
100
T
e
m
p
e
ra
tu
re
[
℃
]
50
150
ramp up to
150℃
min.3k/s
min.110s
min.190 ℃
250 200
time [s]
300 400 350
ramp down
from T(solid)
min.6k/s
max.90s
BSP1109-05H1.7J LF
Piezo Sounder
2
Page:5 of 7
1
A
Unit:mm
B
C
2
.0
±0
.1
max5
°
A-A
D
E
F
G
BSP1109-05H1.7J LF
6
3.10 Recommended Temp. Profile for Reflow Oven
H
Temperature profile for a lead-free reflow process
T(solid)min.217 ℃
300
250
min.300s
5
max.260 ℃
min.40s
max.255 ℃
4 3
H
2 1
DRG NO: BS/TEP01.646A
09/01/14
李红元
邱 俊
赵 峥
H
PS
0 911A
J
L
N
XX