BeStar SMT1212-05XH6.5 LF - Manual (Page 5)

T
h
is
p
ri
n
t
a
n
d
i
n
fo
rm
a
tio
n
t
he
re
i
n
a
re
p
ro
p
ri
e
ta
ry
t
o
B
e
s
ta
r
E
le
c
tr
o
n
ics
I
ndu
s
tr
y
C
o
.,
L
td.
a
nd
s
h
a
ll
no
t
b
e
u
s
ed
i
n
w
h
o
le
o
r
in
pa
rt
w
ith
ou
t
it
s
w
ri
tt
en
c
on
tent
Checked by:
A
6
REV. Date
www.be-star.com [email protected]
Note
5
Drawn
4
Approved by:
2 3 1
Page:05 of 09
Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)
B
C
D
Drawn by:
Date:
A
B
C
D
In automated mounting of The SMD Sound Transducers on printed circuit boards,any
bending,expanding and pulling forces or shocks against the SMD Sound Transducers shall
be kept to a minimum to prevent them from electrical failures and mechanical damages of
the devices.
Soldering(Reflow)
(1)Soldering of The SMD Sound Transducers shall conform to the soldering conditions in
the individual specifications.
(2)The SMD Sound Transducers are designed for"Reflow Soldering"
(3)In the reflow soldering,too high soldering temperatures and too large tempearture
gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
4.Surface Mounting Condition
Following soldering conditions are recommended; Refer to Fig.1
E
F
G
H
6 5 4 3 2 1
E
F
G
H
300
300 0
0
50 100
time [s]
200 150 250 350 400
max.90s
min.40s
T
e
m
pe
ra
tu
re
[
℃
]
ramp up to
150℃
min.3k/s
50
150
100
min.110s
min.300s
min.190℃
200
250
T(solid)min.217 ℃
max.260℃
ramp down
from T(solid)
min.6k/s
max.255℃
Temperature profile for a lead-free reflow process
Transducer
SMT1212-05XH6.5 LF
DRG NO: BS/TET01.059D
魏奉玲
徐 波
陶红仲
SMT1212-05XH6.5 LF
Notice: All specification must be satisfied in this condition except SPL. SPL shall be 82dB or more.
博 士 達
王善梅 06/02/17 B
09/08/19
07/08/25 C
change into reel
魏奉玲 09/08/19 D change the height
packing 王善梅
add reflow soldering
curve