Rainbow Electronics DS1747P - Manual (Page 16)

DS1747/DS1747P
16 of 18
DS1747P
PKG INCHES
DIM MIN NOM MAX
A 0.920 0.925 0.930
B 0.980 0.985 0.990
C - - 0.080
D 0.052 0.055 0.058
E 0.048 0.050 0.052
F 0.015 0.020 0.025
G 0.025 0.027 0.030
NOTE:
Dallas Semiconductor recommends that PowerCap Module bases experience one pass through solder
reflow oriented with the label side up (“live – bug”).
Hand Soldering and touch–up: Do not touch or apply the soldering iron to leads for more than 3 (three)
seconds. To solder, apply flux to the pad, heat the lead frame pad and apply solder. To remove the part,
apply flux, heat the lead frame pad until the solder reflows and use a solder wick to remove solder.