Rainbow Electronics APExx04 - Manual (Page 6)

APExx04 Series
Rev 1.4 2004/4/20
5
6.0 Bonding Diagram
Pad # Pad Name X Y Pad # Pad Name X Y
1
PWM2 57 253
7
PRA0 785 87
2
Vdd1 58 58
8
PRA1 895 87
3
PWM1 253 57
9
PRA2 1005 87
4
GND1 404 58
10
GND2 995 231
5
Vdd2 565 87
11
PRA3 995 341
6
OSC 675 87
Chip Size :
APE0504
: 1166 um x 1094 um
APE1004
: 1166 um x 1206 um
ROM
PRA3
2 3
4
5
6 7 8 9
10
11
GND2
PRA2 PRA1 PRA0 OSC Vdd2
GND1 PWM1
PWM2/Cout
Vdd1
1
(0, 0)
Pad Size: 80 um x 80 um
* The IC substrate must be connected to GND.
X
Y