Rainbow Electronics APR6016 - Manual (Page 22)

Preliminary
APR6016 Data Sheet
Voice Recording & Playback Device Page 22
Revision 1.0
Figure 18 Bond Pad Layout and Coordinates
10 /R E S E T
11 V S S A
12 VS S A
13 V SS A
14 A U D O U T
15 S QLC A P
16 /S Q LO U T
17 A N A IN -
18 A N A IN +
19 V C C A
20 V C C A
21
N
C
22
/B
U
SY
9
A
N
A
O
U
T+
8 A
N
A
O
U
T-
N C 27
N C 28
VS
S
A
23
VS
S
A
24
VS
S
A
25
SA
C
2
6
/IN T 29
E XT C LK 30
V C C D 31
V C C D 32
N
C
7
N
C
6
V S SD 5
V S SD 4
/C S 1
D I 2
D O 3
VC C D 33
O rig in
Table 7 Coordinate Information
DIE SIZE 8230µ x 4 36 0µ
PAD SIZE:100µ x 1 00µ
DIE THICKNESS: Approximately 25 mils
NOTE:
1. Substrate should be connected to GND.
2. Coordinates given in Table 7 are for pad centers.
Pad
Number Pad Name
X
Coordinate
Y
Coordinate
1 /CS 8008 1460
2 DI 8008 1173
3 DO 8008 865
4 VSSD 8008 620
5 VSSD 8008 393
6 NC 7654 119
7 NC 7271 119
8 ANAOUT- 570 119
9 ANAOUT+ 299 119
10 /RESET 119 384
11 VSSA 119 665
12 VSSA 119 837
13 VSSA 119 1124
14 AUDOUT 119 1454
15 SQLCAP 119 1894
16 /SQLOUT 119 2528
17 ANAIN- 119 2805
18 ANAIN+ 119 3076
19 VDDA 119 3407
20 VDDA 119 3637
21 NC 258 4116
22 /BUSY 558 4116
23 VSSA 7172 4116
24 VSSA 7345 4116
25 VSSA 7517 4116
26 SAC 7765 4116
27 NC 8008 3806
28 NC 8008 3506
29 /INT 8008 3114
30 EXTCLK 8008 2808
31 VCCD 8008 2433
32 VCCD 8008 2200
33 VCCD 8008 2029
34 SCLK 8008 1802
Pad
Number Pad Name
X
Coordinate
Y
Coordinate
0
0 X Coordinate
Y Coor
di
nat
e
S C LK 34