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Applications information, Chip information, Functional block diagram – Rainbow Electronics MAX6632 User Manual

Page 7

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Applications Information

Thermal Considerations

The key to accurate temperature monitoring is good
thermal contact between the MAX6629–MAX6632
package and the object being monitored. In some
applications, the 6-pin SOT23 package is small enough
to fit underneath a socketed µP, allowing the device to
monitor the µP’s temperature directly. Accurate temper-
ature monitoring depends on the thermal resistance
between the object being monitored and the
MAX6629–MAX6632 die. Heat flows in and out of plas-
tic packages primarily through the leads. If the sensor
is intended to measure the temperature of a heat-gen-
erating component on the circuit board, it should be
mounted as close as possible to that component and
should share supply and ground traces (if they are not
noisy) with that component where possible. This maxi-
mizes the heat transfer from the component to the sen-
sor.

The MAX6629/MAX6630 supply current is typically
200µA, and the MAX6631/MAX6632 supply current is
typically 32µA. When used to drive high-impedance
loads, the device dissipates negligible power.
Therefore, the die temperature is essentially the same
as the package temperature.

The rise in die temperature due to self-heating is given
by the following formula:

∆T

J

= P

DISSIPATION

x

θ

JA

where P

DISSIPATION

is the power dissipated by the

MAX6629–MAX6632, and

θ

JA

is the package’s thermal

resistance.

The typical thermal resistance is +110°C/W for the
6-pin SOT23 package. To limit the effects of self-heat-
ing, minimize the output currents. For example, if the
MAX6629–MAX6632 sink 1mA, the output voltage is
guaranteed to be less than 0.4V. Therefore, an addi-
tional 0.4mW of power is dissipated within the IC. This
corresponds to a 0.044°C shift in the die temperature in
the 6-pin SOT23.

Chip Information

TRANSISTOR COUNT: 6475

PROCESS: BiCMOS

MAX6629–MAX6632

12-Bit + Sign Digital Temperature Sensors

with Serial Interface

_______________________________________________________________________________________

7

VOLTAGE

REFERENCE

SPI-COMPATIBLE

INTERFACE

TEMPERATURE

SENSOR

12-BIT + SIGN

∑∆ ADC

MAX6629
MAX6630
MAX6631
MAX6632

SO

SCK

CS

Functional Block Diagram