Texas Instruments Modular Evaluation Module MSOP8 - Manual (Page 19)

6-1 EVM BOM and Schematic
EVM BOM and Schematic
The following table contains a complete bill of materials for the modular
MSOP8 EVM bill of materials.
Table 6 - 1. Bill of Materials
Designators Description Manufacturer Mfg. Part Number
C2 C3 C4 C13 Not Installed
R11 Not Installed
C1 0.47 µ F, 0805, ceramic, X7R, 25 V, 10% Panasonic ECJ - 2YB1C474K
C11 C12 C14 0.1 µ F, 0805, ceramic, X7R, 50 V, 10% Panasonic ECJ - 2YB1H104K
C6 C8 C10 10 µ F, 1206, ceramic, Y5V, 10 V, 10% Panasonic ECJ - 3YF1A106Z
C5 C14 C15 10 µ F, A case, tantalum, 10 V Panasonic ECS - T1AY106R
L1 L2 L3 15 µ H inductor, SMT, 1608 Series Inductors, Inc. CTDS1608C - 153
J1 J2 (top side) 10 Pin, dual row, SMT header (20 [postive) Samtec TSM - 110 - 01 - T - DV - P
J1B J2B (bottom side) 10 Pin, dual row, SMT socket (20 positive) Samtec SSW - 110 - 22 - F - D - VS - K
J3 (bottom side) 5 Pin, dual row, SMT socket (10 posotove) Samtec SSW - 105 - 22 - F - D - VS - K
R9 R10 R12 33 Ω , 0805, 5%, .1W Resistor Yageo America 9C08052A33R0JLHFT
R1 R2 R3 R4 R6 0 Ω , 0805, 0.1 W resistor Yageo America 9C08052A0R00JLHFT
TP1 TP2 TP3 TP5 TP7 Red test point loop Keystone 5001
TP4 TP6 Black test point loop Keystone 5000
U1 Varies (see Note)
U2 REF3025 TI REF3025AIDBZT
U3 U5 U6 SN74LVC1G125 TI SN74LVC1G125DBVT
U4 OPA353N TI OPA353NA/250
JMP1 JMP2 JMP5
JMP6 3 Pin , 2 mm header Samtec TMMH - 103 - C - S - T
JMP3 4 Pin, dual row, TH header (8 positive) Samtec TSW - 104 - 07 - L - D
Note: The device installed at location U1 is dependent on the EVM ordered. This device is soldered to the board for best perfor-
mance. U1 may be replaced with any device listed in the EVM compatible device data sheets table found at the beginning
of this document.
Topic Page
6.1 EVM Schematic 6-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Chapter 6