Package outline, Cgd942c, Nxp semiconductors – NXP Semiconductors CGD942C User Manual
Page 4: Fig 1. package outline sot115j
CGD942C
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 3 — 29 September 2010
4 of 8
NXP Semiconductors
CGD942C
870 MHz, 23 dB gain power doubler amplifier
6. Package
outline
Fig 1.
Package outline SOT115J
UNIT
A2
max.
c
e
e1
q
Q
max.
q1
q2
U2
U1
W
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
JEITA
mm
20.8
9.5
0.51
0.38
0.25 27.2
2.04
2.54
13.75 2.54 5.08 12.7 8.8
4.15
3.85
2.4
38.1 25.4 10.2 4.2
44.75
44.25
8.2
7.8
0.25
0.1
3.8
b
F
p
6-32
UNC
y
w
0.7
x
S
DIMENSIONS (mm are the original dimensions)
SOT115J
0
5
10 mm
scale
A
max.
D
max.
L
min.
E
max.
Z
max.
Rectangular single-ended package; aluminium flange; 2 vertical mounting holes;
2 x 6-32 UNC and 2 extra horizontal mounting holes; 7 gold-plated in-line leads
SOT115J
D
U1
q
q2
q1
b
F
S
A
Z
p
E
A2
L
c
d
Q
U2
M
w
7
8
9
2
3
W
e
e1
5
p
1
d
x
M
B
y
M
B
B
04-02-04
10-06-18
y
M
B