Package outline, Tda8752b, Philips semiconductors – NXP Semiconductors Triple high-speed Analog-to-Digital Converter 110 Msps TDA8752B User Manual
Page 32
Philips Semiconductors
TDA8752B
Triple high-speed Analog-to-Digital Converter 110 Msps
Product specification
Rev. 03 — 21 July 2000
32 of 38
9397 750 07338
© Philips Electronics N.V. 2000. All rights reserved.
14. Package outline
Fig 14. SOT317-2 package outline.
UNIT
A
1
A
2
A
3
b
p
c
E
(1)
e
H
E
L
L
p
Z
y
w
v
θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
mm
0.25
0.05
2.90
2.65
0.25
0.40
0.25
0.25
0.14
14.1
13.9
0.65
18.2
17.6
1.0
0.6
7
0
o
o
0.15
0.1
0.2
1.95
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
1.0
0.6
SOT317-2
MO-112
97-08-01
99-12-27
D
(1)
(1)
(1)
20.1
19.9
H
D
24.2
23.6
E
Z
0.8
0.4
D
e
θ
E
A
1
A
L
p
detail X
L
(A )
3
B
30
c
b
p
E
H
A
2
D
Z D
A
Z E
e
v
M
A
1
100
81
80
51
50
31
pin 1 index
X
y
b
p
D
H
v
M
B
w
M
w
M
0
5
10 mm
scale
QFP100: plastic quad flat package; 100 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm
SOT317-2
A
max.
3.20