SMSC LPC47M997 - Manual (Page 5)

SMSC LPC47M997 Page 5 Rev. 01-12-07
PRODUCT PREVIEW
Package Outline
Figure 2 - 128 PIN QFP Package Outline, 14x20x2.7 Body, 3.2 mm Footprint
Table 1 - 128 PIN QFP Package Parameters
MIN NOMINAL MAX REMARKS
A ~ ~ 3.4 Overall Package Height
A1 0.05 ~ 0.5 Standoff
A2 2.55 ~ 3.05 Body Thickness
D 23.00 23.20 23.40 X Span
D1 19.90 20.00 20.10 X body Size
E 17.00 17.20 17.40 Y Span
E1 13.90 14.00 14.10 Y body Size
H 0.09 ~ 0.20 Lead Frame Thickness
L 0.73 0.88 1.03 Lead Foot Length
L1 ~ 1.60 ~ Lead Length
e 0.50 Basic Lead Pitch
θ 0 o ~ 7 o Lead Foot Angle
W 0.10 ~ 0.30 Lead Width
R1 0.08 ~ ~ Lead Shoulder Radius
R2 0.08 ~ 0.30 Lead Foot Radius
ccc ~ ~ 0.08 Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.