Samsung 1H 2011 - Manual (Page 9)

samsung.com/semi/dram 9
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1H 2011 Mobile & Graphics DRAM Components
GrAPHicS drAM coMPonentS
Type Density Organization Part Number Package VDD/VDDQ Speed Bin (MHz)
GDDR5
2Gb 64Mx32
K4G20325FC-HC(1) 170-FBGA 1.5/1.5V 2000/2500/3000
K4G20325FC-HC04 170-FBGA 1.35V/1.35V 1800
K4G20325FC-HC03 170-FBGA 1.35V/1.35V 2000
1Gb 32Mx32
K4G10325Fe-HC(1) 170-FBGA 1.5/1.5V 2000/2500
K4G10325Fe-HC04 170-FBGA 1.35V/1.35V 1800
GDDR3
1Gb 32Mx32 K4J10324Ke-HC(1) 136-FBGA 1.8V/1.8V 700/800/1000/1200
512Mb 16Mx32 K4J52324KI-HC(1) 136-FBGA 1.8/1.8V 700/800/1000
gDDR3
2Gb 128Mx16 K4W2G1646C-HC(1) 96 FBGA 1.5V/1.5V 800/933/1066
1Gb 64Mx16 K4W1G1646G-BC(1) 96 FBGA 1.5V/1.5V 800/933/1066
gDDR2 1Gb 64Mx16 K4N1G164Qe-HC(1) 84-FBGA 1.8/1.8V 400/500
Notes: Package
H: FBGA (Halogen Free & Lead Free)
B: FBGA (Halogen Free & Lead Free)
(1) Speeds (clock cycle - speed bin)
03: 0.3ns (3000MHz)
04: 0.4ns (2500MHz)
05: 0.5ns (2000MHz)
5C: 0.555 (1800MHz)
08: 0.83ns (1200MHz)
1A: 1ns (1000MHz GDDR3)
1A: 1ns (1066MHz gDDR3)
11: 1.1ns (933MHz)
12: 1.25ns (800MHz)
14: 1.429ns (700MHz)
20: 2.0ns (500MHz)
25: 2.5ns (400MHz)
MoBile drAM coMPonentS
Type Density Organization Part Number Package Power Production
MsDR 512Mb
32Mx16 K4M51163PI-BG(1) 54-FBGA 1.8V Now
16Mx32 K4M51323PI-HG(1) 90-FBGA 1.8V Now
MDDR
256Mb
16Mx16 K4X56163PN-FG(1) 60-FBGA 1.8V Now
8Mx32 K4X56323PN-8G(1) 90-FBGA 1.8V Now
512Mb
32Mx16 K4X51163PI-FG(1) 60-FBGA 1.8V Now
16Mx32 K4X51323PI-8G(1) 90-FBGA 1.8V Now
1Gb 32Mx32 K4X1G323PF-8G(1) 90-FBGA 1.8V Now
2Gb 64Mx32 K4X2G323PC-8G(1) 90-FBGA 1.8V Now
4Gb
x32 (2Cs, 2CKe) K4X4G303PC-AG(1) 168-FBGA, 12x12 PoP, DDP 1.8V Now
x32 (2Cs, 2CKe) K4X4G303PC-7G(1) 240-FBGA, 14x14 PoP, DDP 1.8V Now
LPDDR2
1Gb 1CH x32 K4P1G324ee-AG(1) 168-FBGA, 12x12 PoP 1.2V Now
2Gb
1CH x32 K4P2G324eC-AG(1) 168-FBGA, 12x12 PoP 1.2V Now
2CH x32/ch K3Pe3e300M-XG(1) 216-FBGA, 12x12 PoP 1.2V Now
4Gb
1CH x32 K4P4G304eC-AG(1) 168-FBGA, 12x12 PoP, DDP, 64Mx32*2 1.2V Now
1CH x32 K4P4G154eC-FG(1) 134-FBGA, 11x11.5 PoP, DDP, 128x16*2 1.2V Now
1CH x32 K4P4G324eB-FG(1) 168-FBGA, 12x12 PoP, MoNo, 128Mx32 1.2V Now
2CH x32/ch K3Pe4e400M-XG(1) 216-FBGA, 12x12 PoP, QDP, 64Mx32*2 1.2V Now
2CH x32/ch K3Pe4e400A-XG(1) 240-FBGA, 14x14 PoP, QDP, 64Mx32*2 1.2V Now
8Gb
1CH x32 K4P8G304eC-FC(1) 134-FBGA, 11x11.5 PoP, QDP, 128x16*4 1.2V Now
2CH x32/ch K3Pe8e800M-XG(1) 216-FBGA, 12x12 PoP, QDP, 64Mx32*4 1.2V Now
2CH x32/ch K3Pe7e700M-XG(1) 216-FBGA, 12x12 PoP, DDP, 128Mx32*2 1.2V Now
2CH x32/ch K3Pe7e700A-XG(1) 240-FBGA, 14x14 PoP, DDP, 128Mx32*2 1.2V Now
16Gb 2CH x32/ch K3Pe0e00M-XG(1) 216-FBGA, 12x12 PoP, QDP, 128Mx32*4 1.2V Now
Notes: (1) Speed:
Mobile-sDR
60: 166MHz, CL3
75: 133MHz, CL3
Mobile-DDR
D8: 200MHz, CL3
C6: 166MHz, CL3
LPDDR2
C1: 800Mbps
All products offered at extended, Low, i-tCsR & PAsR & Ds (temp, Power)