Chapter 2 package outline, Table 1 128 pin qfp package parameters, Product preview – SMSC SCH5027E User Manual
Page 5
Super I/O with Temperature Sensing, Quiet Auto Fan and Glue Logic
with PECI
SMSC SCH5027E
5
Revision 0.2 (02-11-09)
PRODUCT PREVIEW
Chapter 2 Package Outline
Figure 3 128 Pin QFP Package Outline, 14X20X2.7 Body, 3.2 mm Footprint
Notes:
1. Controlling Unit: millimeter.
2. Controlling Unit: millimeter.
3. Tolerance on the position of the leads is ± 0.04 mm maximum.
4. Package body dimensions D1 and E1 do not include the mold protrusion.
5. Maximum mold protrusion is 0.25 mm.
6. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
7. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 1 128 Pin QFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
3.4
Overall Package Height
A1
0.05
~
0.5
Standoff
A2
2.55
~
3.05
Body Thickness
D
23.00
23.20
23.40
X Span
D1
19.90
20.00
20.10
X body Size
E
17.00
17.20
17.40
Y Span
E1
13.90
14.00
14.10
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.73
0.88
1.03
Lead Foot Length
L1
~
1.60
~
Lead Length
e
0.50 Basic
Lead Pitch
q
0
o
~
7
o
Lead Foot Angle
W
0.10
~
0.30
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.30
Lead Foot Radius
ccc
~
~
0.08
Coplanarity