Package outline, Table 1 64 pin tqfp package parameters, Product preview – SMSC USB2504 User Manual
Page 5
Integrated USB 2.0 Compatible 4-Port Hub
SMSC USB2504/USB2504A
5
Revision 2.3 (08-27-07)
PRODUCT PREVIEW
Package Outline
Figure 2 64 Pin TQFP Package Outline (10x10x1.4 mm body - 2 mm footprint)
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
Maximum mold protrusion is 0.25 mm per side.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
Table 1 64 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
REMARKS
A
~
~
1.60
Overall Package Height
A1
0.05
~
0.15
Standoff
A2
1.35
~
1.45
Body Thickness
D
11.80
~
12.20
X Span
D1
9.80
~
10.20
X body Size
E
11.80
~
12.20
Y Span
E1
9.80
~
10.20
Y body Size
H
0.09
~
0.20
Lead Frame Thickness
L
0.45
0.60
0.75
Lead Foot Length
L1
~
1.00
~
Lead Length
e
0.50 Basic
Lead Pitch
q
0
o
~
7
o
Lead Foot Angle
W
0.17
0.22
0.27
Lead Width
R1
0.08
~
~
Lead Shoulder Radius
R2
0.08
~
0.20
Lead Foot Radius
ccc
~
~
0.08
Coplanarity