Interlink Electronics Ring Sensor - Manual (Page 6)

www.interlinkelectronics.com
4
Ring Sensor
Integration Guide
STIFFENER SUBSTRATE
FSR SUBSTRATE
STIFFENER ADHESIVE REAR ADHESIVE
GRAPHIC ADHESIVE
8.0 STIFFENER
0
.3
0
0
.5
5
GRAPHIC
42.7
USER
ACTIVE AREA
43.0
13.3
5.
0
4.0 Mounting and Connection
4.1 Mounting
There are a few critical elements to consider when mounting the Ring Sensor:
 The mounting surface should be free of any raised features (e.g. copper traces on a PCB
or dust contamination) as they will interfere with the sensor’s proper operation.
 If the sensor is being mounted to a PCB, it should be installed after PCB assembly is
complete. Heat generated during the soldering of components can damage the Ring
Sensor.
 When laminating the sensor, be sure to use a hard roller or other depression tool to ensure
proper bonding of the sensor’s pressure-sensitive adhesive and the removal of any air
bubbles.
Figure 3: Overall dimensions of the Ring Sensor. All dimensions are in millimeters.