Sun Microsystems SME5224AUPA-400 - Manual (Page 54)

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SME5224AUPA-400 400 MHz CPU, 4.0 MB E-Cache
UltraSPARC ™ -II CPU Module
July 1999 Sun Microsystems, Inc
H ANDLING CPU M ODULES
CAUTION: Handle a module by carefully holding it by its edges and by the large CPU heatsink. Do not
bump or handle the SRAM heatsinks because this action can cause unseen damage to the solder connections.
Always handle modules and other electronic devices in an ESD-controlled environment.
S TORAGE AND S HIPPING S PECIFICATION
Parameter Conditions
Value
Unit Min. Typ. Max
Temperature Ambient -40 – 90
°
C
Temperature ramp Ambient – – 10
°
C/min.
Shock (shipping)
- single module package
Drop height on to any edge, corner, or side of
shipping box – – 21 inches
Shock(shipping)
- multi-module package
Drop height on to any edge, corner, or side of
shipping box – – 18 inches