Setting the cutting depth, Vacuum extraction of dust / debris (see fig. a), Parking shoe (see figs. b / c) – Parkside PEH 30 A1 User Manual
Page 30: The planing process, Chamfering edges (see fig. h)
30 GB
Preparing for use / Maintenance and cleaning
Preparing for use
Switching off:
Release the ON / OFF switch
2
.
Note: For safety reasons the ON / OFF switch
2
cannot be locked in the ON position.
Q
Setting the cutting depth
The rotary control
13
can be used to set the cutting
depth in steps from 0–3.0 mm according to the cut-
ting depth scale
14
.
Q
Vacuum extraction of dust /
debris (see Fig. A)
DANGER OF INJURY!
Before you carry out any work on the device always
pull the mains plug out of the mains socket.
Planing debris removal port (right / left
selectable):
Release the planing debris removal port
3
by
turning it against the direction of the arrow (out
of the “Lock” position).
Pull the planing debris removal port
3
out of
the device.
The planing debris removal port
3
can be set
to face left or right in the planer.
Push the planing debris removal port
3
into
the device.
Lock the planing debris removal port
3
by
turning it into the “Lock” position.
External vacuum extraction:
If necessary fit the reducer piece
15
when using
a dust extraction system, e.g. a workshop dust
extraction system.
The vacuum cleaner / dust extraction device used
must be suitable for the material being planed.
Connection:
Place the reducer piece
15
firmly on to the
planing debris removal port
3
.
Push the hose of a suitable dust extraction device
approved for that purpose (e.g. a workshop
vacuum cleaner) on to the planing debris remov-
al port
3
or the reducer piece
15
.
Removal:
Pull the hose of the dust extraction device off
the planing debris removal port
3
or off the
reducer piece
15
.
Pull off the reducer piece
15
, if fitted.
Q
Parking shoe (see Figs. B / C)
The parking shoe
16
allows you to lay the device
down without the risk of damaging the workpiece.
When planing, the parking shoe
16
swings up and
exposes the rear part of the sole
9
.
Q
The planing process
CAUTION! DANGER OF KICKBACK!
Always switch on the device before placing it
against the workpiece.
Set the required cutting depth.
Switch on the device.
Always place the front part of the sole
9
down
first on to the workpiece.
Guide the device with even forward movement
over the surface being planed.
Move the device forward at a slow rate and
ensure that the contact pressure acts evenly on
the sole
9
. Moving forward at too great a rate
results in a poorer surface quality and can lead
to blocking of the planing debris removal port.
Q
Chamfering edges (see Fig. H)
The V-grooves
10
in the front sole
9
allow the device
to be used for simple chamfering of workpiece edges.
Use the V-groove most appropriate to your
desired chamfer width.
Place the planer with the V-groove
10
on the work-
piece edge and guide the planer along the edge.