Recommended pad layout, Production considerations – Linx Technologies LICAL-DEC-HS001 User Manual
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Receiver
Decoder
Create Key
Make Copy
Set Permissions
Transmitter
1
Encoder
1
Transmitter
2
Encoder
2
Transmitter
15
Encoder
15
Receiver
Decoder
Copy
Set Permissions
Receiver
Decoder
Copy
Set Permissions
Receiver
Decoder
Copy
Set Permissions
Expanded Access Points
Basic System
Figure 17: Expanding Access Points with the HS Series
Recommended Pad Layout
The HS Series encoders and decoders are implemented in an industry
standard 20-pin Shrink Small Outline Package (20-SSOP). The
recommended layout dimensions are shown in Figure 18.
Production Considerations
These surface-mount components are designed to comply with standard
reflow production methods. The recommended reflow profile is shown in
Figure 19 and should not be exceeded, as permanent damage to the part
may result.
0.047
(1.19)
0.016
(0.41)
0.026
(0.65)
0.328 (8.33)
0.234 (5.94)
Figure 18: PCB Layout Dimensions
240°C Max
0
25
50
75
100
125
150
175
200
225
250
TEMPERATURE (°C)
275
0
20
40
60
80
100
120
140
160
180
200
220
240
260
280
300
320
TIME (SECONDS)
340
360
380
420
400
260°C Max
Lead-Free
Sn / Pb
Figure 19: HS Series Reflow Profile