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Hardware specifications – NEXCOM nROK 3000 User Manual

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Chapter 1: Product Introduction

Copyright © 2012 NEXCOM International Co., Ltd. All rights reserved

nROK 3000 User Manual

Hardware Specifications

Main Chipset
• Intel

®

ICH-8M

CPU
• Intel

®

Atom™ D525 Dual Core 1.8GHz

Memory
• 1GB DDR3 1333MHz SODIMM (up to 4GB)

Expansion
• Mini PCIe socket (USB) x 1 (for 3.5G module)
• 1 x GPS module
• Mini PCIe socket (PCIe + USB) x 1 (for WLAN module)

I/O Interfaces - Front
• 1 x DVI-I connector with DVI-D and VGA output
• 1 x 26-pin circular connector in support of RS-232/ 422/ 485 with isolation,

4-channel digital input and 4-channel digital output

• 1 x USB 2.0 with M12 connector
• 1 x Mic-in & 1 x Line-out
• 3 x 10/100 Ethernet with M12 connector
• Wireless communication

1 x External accessible SIM card socket
3 x Antenna holes for WWAN/ WLAN/ GPS

• 4 x LED for power, SSD, WWAN and WLAN
• DC Input

24V with 500V isolated (range: 16.8V ~ 30V)
Optional: 110V with 1.5KV isolation (range: 66V ~ 154V)

I/O Interfaces - Rear
• SSD accessible
• 2 x USB 2.0
Expandable Storage
• 1 x SATA 2.5” SSD Bay
• 1 x CFast slot with protection cover
Dimensions
• 260mm (W) x 178mm (D) x 70mm (H) (10.24”x 7”x 2.76”)
Construction
• Aluminum enclosure with fanless design
Environment
• Operating temperatures

Ambient with air: -40°C to 55°C (EN50155 Class T2)

• Storage temperatures: -40°C to 80°C
• Damp heat test: 55°C, 95% RH (non-operating, EN 50155)
• Relative humidity: 0% to 90% (non-condensing)
• Vibration (random):

Compliance with EN61373 Category 1 Class B

• Shock:

Compliance with EN61373 Category 1 Class B

Certifications
• CE approval
• FCC Class A
• Compliance with EN50155