Availability, Dispensing parameters, Recommended reflow profile – HMC Electronics R276 Kester Lead-Free Paste User Manual
Page 2: Cleaning, Storage, handling, and shelf life, Health & safety
Application Notes
Availability:
R276 is available in the Sn96.5 Ag3.0Cu0.5 and Sn96.5Ag3.5 alloys. Type 3 powder mesh is recommended,
but Type 4 is available for fine needle applications. R276 is also compatible with other SnAgCu alloys in a
similar melting range to the listed alloys. R276 is available only in 10cc and 30cc syringes. For specific
packaging information, see Kester's Solder Paste Chart.
Dispensing Parameters:
Needle diameter
Type 3 powder may be used with needle sizes down to 22 gauge.
Type 4 powder may be used for finer needle applications.
Dispense Speed
Capable of at least 4 dots per second
Temperature/Humidity
Optimal ranges are 21-25°C (70-77°F) and 35-65% R.H.
Recommended Reflow Profile:
The recommended reflow profile for R276 made
with SAC alloys is shown here. This profile is
simply a guideline. Since R276 is a highly active
solderpaste, it can solder effectively over a wide
range of profiles. Your optimal profile may be
different from the one shown based on you oven,
board and mix of defects. Please contact Kester if
you need additional profiling advice.
Cleaning:
R276 is a no-clean formula. The residues do not need to be removed for typical applications. Although R276
is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment
(in-line or batch) with a variety of readily available cleaning agents. Call Kester Technical Support for details.
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,
reflow characteristics and overall performance. R276 should be stabilized at room temperature prior to
dispensing. R276 should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact
Kester if you require additional advice with regard storage and handling of this material. Shelf life is 6 months
from date of manufacture when handled properly when held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA
Phone: (+1) 630-616-4000 • Email: [email protected] • Website: www.kester.com
Kester Reflow Profile
SnAgCu Alloys
0
50
100
150
200
250
300
0
30
60
90
120
150
180
210
240
270
300
Time (sec.)
Temperature (C)
Pre-heating Zone
(2.0-4.0 min. max.)
Soaking Zone
(2.0 min.max.)
60-90 sec. typical
Reflow Zone
time above 217 C
(90 sec max)
60-75 sec. typical
Peak Temp.
235 - 255 C
<2.5 C/Sec
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
European Headquarters
Zum Plom 5
08541 Neuensalz
Germany
(+49) 3741 4233-0
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten-
tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
R276
Rev: 21Sep09
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440