Availability, Dispensing parameters, Recommended reflow profile – HMC Electronics R500 Kester Solder Paste User Manual
Page 2: Cleaning, Storage, handling, and shelf life, Health & safety, C (32-50
Application Notes
Availability:
Kester R500 is available in the Sn63Pb37 and Sn62Pb36Ag02 alloys with Type 3 powder. Type 3 powder
mesh is recommended for all typical dispensing applications. For specific packaging information see
Kester's Solder Paste Packaging Chart for available sizes. The appropriate combination depends on
process variables and the specific application.
Dispensing Parameters:
Needle size
15 to 21 gauge (with Type 3 powder)
Dispense Rate
Capable of 4 dots/second
Temperature/Humidity
Optimal ranges are 21-25°C (70-77°F) and 35-65% RH
Recommended Reflow Profile:
The recommended reflow profile for R500 made with
Sn63Pb37 and Sn62Pb36Ag02 alloys is shown here.
This profile is simply a guideline. Since R500 is a high-
ly active, water soluble solderpaste, it can solder effec-
tively over a wide range of profiles. Your optimal profile
may be different from the one shown based on your
oven, board and mix of defects. Please contact Kester
if you need additional profiling advice.
Cleaning:
R500 residues are best removed using automated cleaning equipment (in-line or batch). De-ionized water is
recommended for the final rinse. Water temperatures should be 49-60
°
C (120-140°F).Kester's 5768
Bio-Kleen
®
saponifier can also be used in a 1-2% ratio for aqueous cleaning systems.
Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,
reflow characteristics, and overall performance. R500 should be stabilized at room temperature prior to
dispensing. R500 should be kept at standard refrigeration temperatures, 0-10
°
C (32-50
°
F). Please contact
Kester if you require additional advice with regard to storage and handling of this material. Shelf life is 6
months from date of manufacture and held at 0-10°C (32-50°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters: 800 West Thorndale Avenue, Itasca, Illinois, 60143-1341 USA
Phone: (+1) 630-616-4000 • Email: [email protected] • Website: www.kester.com
Kester Reflow Profile
Alloy: Sn63Pb37 or Sn62Pb36Ag02
0
20
40
60
80
100
120
140
160
180
200
220
240
0
30
60
90
120
150
180
210
240
270
300
330
Time (sec.)
Temperature (C)
Time to Peak Temperature
3.5-5.0 min. typical
5.5 min max
Soaking Zone
(120 sec. max.)
30-60 sec. typical
Reflow Zone
45-75 sec. typical
Peak Temp.
210 - 225 C
<1.8 C/Sec
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
European Headquarters
Zum Plom 5
08541 Neuensalz
Germany
(+49) 3741 4233-0
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten-
tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
R500
Rev: 21Sep09
Documentation Provided By HMC Electronics
33 Springdale Ave. Canton, MA 02021
(800) 482-4440