BeStar BSP1010-05H03 LF - Manual (Page 5)

T
h
is
p
ri
n
t
and
i
n
fo
rm
a
ti
on
t
he
re
i
n
a
re
p
rop
ri
e
ta
ry
t
o
B
e
s
ta
r E
le
c
tr
on
ics
I
ndu
s
tr
y
C
o
.,
L
td.
and
s
ha
ll
no
t
be
u
s
ed
i
n
w
ho
le
o
r
in
p
a
rt
w
it
hou
t
it
s
wr
itt
en
c
on
tent
Trailer160-200
25.5
Drawn by:
Date:
Unit:mm
The cover film peel strength force 0.1-0.7N
The cover film peel speed 300mm/min .
33.5 Max
B
C
400-560 Leader
100
0
.5
13
0
.2
330 Max
Diameter
240~280
Empty
Cover Film
Components
D
Dimensions of reel
B
C
D
4.1 packing drawing
E
F
Dimensions of carrier tape
4. Tape on Reel Packing
3.10 Recommended Temp. Profile for Reflow Oven
G
E
F
G
BSP1010-05H03 LF
6
H
5 4 3
H
2 1
6
A
REV. Date
5
Drawn Note
www.be-star.com [email protected]
4 3
Checked by:
Approved by:
2 1
Page:4 of 6
Piezo Sounder A
400
Temperature profile for a lead-free reflow process
max.255℃ max.260℃
max.90s
T(solid)min.217 ℃ min.40s
250
300
min.190℃
150
200
min.300s
ramp down
from T(solid)
min.6k/s
300 350 150 200
time [s]
250
ramp up to
150℃
min.3k/s
50
100
50 100 0
0
min.110s
T
e
m
p
e
ra
tu
re
[
℃
]
B
A
B
16 0.1
Min. 1.5
24
0
.2
4.0 0.1
2.0 0.1 1.5 +0.1
-0.0
11
.5
±0
.1
1
.75
0
.1
max5
°
A-A
B-B
2
.7
0
.1
12
.5
0
.1
0.3 0.05
12.5 0.1
X.XX
010-
03 LF
ar
XX.XX
BSP1010
05H03 LF
Bestar
XX.XX
BSP1010-
05H03 LF
Bestar
XX.XX
BSP1010-
05H03 LF
Bestar
B 07/08/16 杨红烨
程久生
张秀琴
07/08/16
杨红烨
BSP1010-05H03 LF
DRG NO: BS/TEP01.244B