Microphone, 5 .application – BeStar BCMMEMS001A-42 LF User Manual
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10.04.27
DRG NO:
Microphone
BS/TEM01.159A
10.04.27
王焕焕
徐 波
张秀琴
Acoustics & Sensor
4.11.PC Board Solder Adhesion :
Each test PC board shall contain only one part .Place PC Board for testing upside
down on two supports spaced 90mm apart centering the part to within
±1mm of
the span .Orient this part such that the longest dimension is perpendicula between
the two supports. Next using a force gauge ,also centering to within
±1mm of the
span's center ,slowly apply a downward vertical force and push with increasing
force until the part's terminations separate from the PC board. Record at which
deflection point mechanical failure occurs. Parts shall withstand a minimum
deflection as described below .Repeat for each test sample. Identify precisel y
where termination stress failure(s) occur and include at least one picture
.
5 .Application:
5.1 Storage temperature range : -40 ℃ ~ +100℃
Operation temperature range : -40 ℃ ~ +100℃
5.2 Recommend Re-flow Prifile
50
150
100
200
T
e
m
p
e
ra
tu
re
[
℃
]
45
0
0
90
min.2.5
℃/sec
time [sec]
180
135
225
270
250
300
Peak Temp
245 ~ 265 ℃
300
Pre Heating Zone
Reflow Zone
Time above 217
Soaking Zone
(120 sec max)
Typical 60 - 90 sec
(90 sec max)
Typical 60 - 90 sec
(120 - 240 sec max)
BCMMEMS001A-42 LF
BCMMEMS001A-42 LF