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Microphone, Temperature profile for a lead-free reflow process – BeStar BCM4013OSBC-38 User Manual

Page 5

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Fig. 1 Recommended soldering Temperature-Time profile (Reflow soldering)

B

C

D

A

B

C

D

Following soldering conditions are recommended; Refer to Fig.1

E

F

G

H

6

5

4

3

2

1

E

F

G

H

300

300

0

0

50

100

time [s]

200

150

250

350

400

max.60s

min.10s

T

emp

e

ra

tu

re

[

]

ramp up to

150℃

min.3k/s

50

150

100

min.110s

min.300s

min.190 ℃

200

250

T(solid)min.217

max.260 ℃

ramp down

from T(solid)

min.6k/s

max.255 ℃

Temperature profile for a lead-free reflow process

DRG NO: BS/TET01.093B

Soldering(Reflow)

(1)Soldering of The SMD Sound Transducers shall conform to the soldering conditions in

the individual specifications.

(2)The SMD Sound Transducers are designed for "Reflow Soldering" under the
recommended solder profile

.

(3)SMD Sound Transducers which during the reflow soldering process are exposed to too
high soldering temperatures and/or too large temperature gradient such as rapid heating or
cooling may lead to electrical failures and mechanical damages of the devices.

A

BCM4013OSBC-38

min.50s

Drawn

Approved by:

Checked by:

Note

Date:

Drawn by:

10.02.26

王焕焕

05.06.14

王丽娟

10.02.26

王焕焕

徐波

张秀琴

B

BCM4013OSBC-38

Microphone

Notice:

All specifications must be satisfied in this condition.
Sensitivity :Allowable deviation within

±3dB from initial sensitivity.