BeStar FT-32G-3.2A12-03 - Manual (Page 3)

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DRG NO: BS/TEY01.333A
A
Rev.
A
5 6
www.be-star.com [email protected]
4 3
Drawn Date Note
Drawn by:
汤浩君
Approved by:
Checked by:
赵 峥
Date:
1
Page:3 of 6
2
Piezo Element A
Fig.2 Direction of Lead Wire
B
Fig.1 Direction of Lead Wire
C
D
B
C
D
3.1 Solderability
280 ±10 Temperaure of Merited Solder,1±0.5sec Duration of Dipping. ℃
3.2 Lead pull off test
a) Wire to be soldered on ceramic at the edge. It should withstand minimum20N
force applied in 180 ° .The wire should not come out before this .The ceramic can be either
glued on a surface of can be held in hand.(Fig.2)
b) Wire to be soldered on ceramic at the edage&should be pulled up at 90 ° The element
should be hold on bottom and wire should be pulled up .It should withstand at least for2N
force(Fig.1)
3.3Bend Test
The element should be bend on to a pipe of 31 ±2mm diameter.The bend should be in only
one direction. The length of pipe should be at least 1.5 times the diameter of the stainless
steel.
E
F
G
E
F
G
3.Characteristics:
H
5 6 4 3
H
1 2
10/03/12
FT-32G-3.2A12-03
FT-32G-3.2A12-03
10/03/12 赵 峥
李红元
博 士 達